-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Cadence Unveils Sigrity 2016 Technology Portfolio
January 21, 2016 | PRNewswireEstimated reading time: 2 minutes
Cadence Design Systems, Inc., has unveiled the Sigrity 2016 technology portfolio, which improves product creation time with an enhanced PCB design and analysis methodology that is ideal for multi-gigabit interfaces.
To speed up the qualification of a physical design for the USB Implementers Forum (USB-IF) compliance test, the Cadence® Sigrity technology portfolio includes automated support for IBIS-AMI model creation, fast and accurate channel model extraction using multiple field solvers, and an automated power-aware signal integrity analysis report to validate a virtual USB 3.1 channel. These technologies, when used together, can shave weeks off the design process.
Previously, IBIS-AMI model creation has been a manual process. The Sigrity 2016 technology portfolio now leverages validated equalization algorithms used by the Cadence Design IP SerDes PHY team and provides an automated methodology for combining, paramaterizing and compiling the algorithms into an executable model. This can increase the pool of engineers capable of efficiently developing SerDes I/O models.
The new "cut and stitch" technology features the ability to create accurate channel models ten times faster by using a mix of hybrid and 3D full-wave field solvers. With minimal manual intervention, the serial link channel can be divided into sections, solved for and automatically stitched together into a single interconnect model. The rapid model extraction technique enables engineers to trade-off various signal routing and layer transition strategies and still meet demanding time-to-market requirements.
Other capabilities that have been enhanced in the portfolio are:
- New quasi-static 3D field solver integrated with 3D full wave and hybrid solver technology available for both IC package and PCB analysis
- Electrical Performance Assessment integrated directly into the IC Package Designer's layout environment
- Optimized decoupling capacitor schemes updated to Allegro® PCB layout
- Improved Power Integrity analysis methodology for PCB designers
To learn more about Sigrity solutions, click here.
"The Sigrity 2016 portfolio features capabilities that increase efficiency and speed up the design process by enabling designers to qualify multi-gigabit standard interfaces such as USB 3.1," said Vinod Kariat, vice president of Custom IC and PCB Group R&D at Cadence. "These features remove the need to manually write and compile code using a software development environment to create SerDes I/O models and that makes modeling of transceivers and interconnects faster."
"Our collaboration with Cadence has allowed both engineering teams to develop tools that can improve our joint customers' product creation process. The Sigrity 2016 release aligns with our customers' needs to address serial link analysis challenges as early as possible," said Brian Reich, General Manager Performance Oscilloscopes, Tektronix. "Together we can help our joint customers reduce weeks from their design cycles as they prototype USB 3.1 interfaces with the Sigrity solution and validate them in the lab with the Tektronix solutions."
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
AI-Powered Wearables Transform How Consumers Interact with Everyday Technology
09/15/2025 | PR NewswireThe global demand for AI-driven, touchless wearable technologies is accelerating as consumers seek more natural, seamless and intuitive ways to interact with their devices. Traditional touch screens and voice assistants, while effective, are increasingly viewed as limiting in a world where multitasking, mobility and efficiency are key. As industries from consumer electronics to augmented reality and enterprise computing embrace the possibilities of gesture-based control, the market for neural interfaces is rapidly expanding
Hanwha Aerospace to Collaborate with BAE Systems on Advanced Anti-jamming GPS for Guided Missiles
09/15/2025 | HanwhaHanwha Aerospace has signed a contract with BAE Systems to integrate next-generation, anti-jamming Global Positioning System (GPS) technology into Hanwha Aerospace’s Deep Strike Capability precision-guided weapon system.
United Electronics Corporation Unveils Revolutionary CIMS Galaxy 30 Automated Optical Inspection System
09/11/2025 | United Electronics CorporationUnited Electronics Corporation (UEC) today announced the launch of its new groundbreaking CIMS Galaxy 30 Automated Optical Inspection (AOI) machine, setting a new industry standard for precision electronics manufacturing quality control. The Galaxy 30, developed and manufactured by CIMS, represents a significant leap forward in inspection technology, delivering exceptional speed improvements and introducing cutting-edge artificial intelligence capabilities.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
DARPA, State of New Mexico Establish Framework to Advance Quantum Computing
09/08/2025 | DARPAAs part of the Quantum Benchmarking Initiative (QBI), DARPA signed an agreement with the State of New Mexico’s Economic Development Department to create the Quantum Frontier Project.