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The Standards of Design
Our expert contributors discuss how PCB designers can utilize standards to save time and money, not to mention frustration. We also spotlight the newly updated version of the IPC Checklist, a handy guide that illustrates which standards cover which topics, from front-end design through assembly.
Rigid-flex: Designing in 3D
In this month’s issue, our expert contributors share their best tips, tricks and techniques for designing rigid-flex circuits. If you’re a rigid board designer considering moving into the 3D world of rigid-flex, this issue is just what the doctor ordered!
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Frontline Releases InCAM 2.32January 22, 2016 | Frontline PCB Solutions
Estimated reading time: 2 minutes
Released on January 10, 2016, InCAM 2.32 is a minor new version that introduces numerous workflow throughput enhancements, including the ability to run Step Compare in the background and to add multiple dimensions simultaneously. In addition, two new DFM functions improve the production process for HDI and IC-packaging boards.
Reduce the galvanic effect during the gold plating process
Run the new Non-Tieline Gold Galvanic Compensation DFM to calculate the gold/copper or copper/gold ratio that is below a defined threshold and take steps to reduce the galvanic effect during gold plating.
Apply etch compensation to the narrow parts of a surface
Use the new Patch Bottlenecks DFM to automatically detect locations where surface width is below the defined value and apply a patch to these locations, enabling the application of etch compensation to the narrow parts of a surface.
Quickly create dimensioned drawing with multiple dimensions
Create dimensioned drawings faster – (co)ordinate, linear or baseline dimensions – by adding multiple dimensions at the same time.
Get Step Compare results per layer as soon as they’re ready
Run Step Compare in the background while getting on with other tasks. Step Compare can run in parallel on different layers, delivering results one by one as they become ready, while the remaining layers continue processing.
Improved sub-assembly electrical testing
Optimize netlists and create an electrical testing program for sub-assembly testing.
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AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.