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Designers Notebook: Layer Stackup Planning for RF Circuit Boards
Frontline Releases InCAM 2.32
January 22, 2016 | Frontline PCB SolutionsEstimated reading time: 2 minutes
Released on January 10, 2016, InCAM 2.32 is a minor new version that introduces numerous workflow throughput enhancements, including the ability to run Step Compare in the background and to add multiple dimensions simultaneously. In addition, two new DFM functions improve the production process for HDI and IC-packaging boards.
New Features
Reduce the galvanic effect during the gold plating process
Run the new Non-Tieline Gold Galvanic Compensation DFM to calculate the gold/copper or copper/gold ratio that is below a defined threshold and take steps to reduce the galvanic effect during gold plating.
Apply etch compensation to the narrow parts of a surface
Use the new Patch Bottlenecks DFM to automatically detect locations where surface width is below the defined value and apply a patch to these locations, enabling the application of etch compensation to the narrow parts of a surface.
Quickly create dimensioned drawing with multiple dimensions
Create dimensioned drawings faster – (co)ordinate, linear or baseline dimensions – by adding multiple dimensions at the same time.
Get Step Compare results per layer as soon as they’re ready
Run Step Compare in the background while getting on with other tasks. Step Compare can run in parallel on different layers, delivering results one by one as they become ready, while the remaining layers continue processing.
Improved sub-assembly electrical testing
Optimize netlists and create an electrical testing program for sub-assembly testing.
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