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RTW IPC APEX EXPO: Rehm Discusses Advantages of Moving Heat Technology
April 20, 2016 | Real Time with...IPCEstimated reading time: Less than a minute

Paul Handler, general manager of Rehm Thermal Systems, speaks with I-Connect007 guest editor Steve Williams about the advantages of the moving heat chamber compared to traditional technology in the market today, and why their systems are all Industry 4.0-ready.
Suggested Items
New Representatives for Rehm Thermal Systems
05/11/2021 | Rehm Thermal SystemsSince 1 April 2021, Rehm Thermal Systems has gained two new representatives for its sales and service activities in Europe: Accelonix Ltd is now the official distributor for United Kingdom and Ireland, while Ankatek will in future look after the product portfolio in Turkey for Rehm Thermal Systems.
RTW NEPCON South China: Rehm Sees Growing Demand for Vacuum Soldering
09/28/2018 | Real Time With... NEPCON South ChinaRalf Wagenfuehr, plant manager of Rehm Thermal Systems (Dongguan) Ltd, speaks with I-Connect007’s Edy Yu about the developments in the company’s convection reflow soldering system, which features a vacuum module, aimed at addressing the increasing demand for vacuum soldering. He also discusses their software developments, as well as how they are helping their customers toward their Industry 4.0 journey.
Altus Releases New Technology Brochure
09/10/2018 | Altus GroupAltus Group has released its new product brochure, featuring some of the world's most innovative equipment for the electronics assembly industry.
Reflow Perspectives to Flex Circuit Assemblies
07/13/2018 | Stephen Las Marias, I-Connect007At the recent NEPCON China 2018 event in Shanghai, I spoke with Ralf Wagenfuehr, plant manager at Rehm Thermal Systems, to gain insight into flex circuit assembly, and the challenges of reflow soldering. He also speaks about the need for industry forums focused on soldering flex printed circuits.
June 2018 Issue of SMT007 Magazine Available Now
06/04/2018 | I-Connect007Manufacturers are having to navigate critical challenges that rock their boat when faced with assembling flexible printed circuits. In the June 2018 issue of SMT007 Magazine, we examine these concerns and highlight some of the strategies and techniques used to address them. Hear from companies such as Lenthor Engineering, Miraco, BEST Inc., Vexos, Thermaltronics, Rehm Thermal Systems, Alpha Assembly Solutions, AIM Metals and Alloys, and more!