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Connect the Dots: Designing for the Future of Manufacturing Reality—Strip-Etch-Strip

02/19/2026 | Matt Stevenson -- Column: Connect the Dots
The demand for ultra-high density interconnect (UHDI) PCBs is growing as electronic devices become increasingly advanced. That means we will be creating more designs that need to align with the reality of manufacturing UHDI boards. My last column on this subject focused on plating, and we are ready to discuss the strip-etch-strip (SES) process. With UHDI boards, footprints are smaller and tolerances are tighter. Your big design challenge associated with the SES process involves trace width and spacing control. The etching process can undercut traces and alter their final size.

Powering the Future: From Thick-Film to DBC—Understanding the Evolution of Ceramic Packaging

02/11/2026 | Brian Buyea -- Column: Powering the Future
Ceramic packaging has quietly powered the electronics revolution for more than half a century. From the earliest thick-film hybrids to today’s direct bond copper (DBC) substrates and metallized aluminum nitride, every step forward in ceramic technology has pushed the limits of reliability, power density, and performance. It’s essential for every design engineer building the next generation of electronic systems to understand this evolution.

Fresh PCB Concepts: Cost Stability in a Period of Copper and Gold Volatility

02/12/2026 | Team NCAB -- Column: Fresh PCB Concepts
Anyone who works with PCBs in any capacity right now can feel that copper and laminate prices are not stagnant, gold price is increasing even faster, and the impact shows up quickly on PCB quotations. For many design teams, this feels like a force outside their control. Raw materials go up, and the board cost goes with it. I want to highlight that many of these swings are manageable.

Connect the Dots: The Future of Designing for Reality—Pattern Plating

02/05/2026 | Matt Stevenson -- Column: Connect the Dots
Last month, I discussed the outer-layer imaging process and offered tips for designers to help ensure smooth manufacturing and high-quality output. The next step in the manufacturing process is copper pattern plating, where fabrication can be tricky, and design precision is even more important. The board is now ready to have the copper traces, through-holes, vias, pads, and other elements specified in the original CAD design plated to copper thickness requirements. I will identify some key design considerations for pattern plating, break down the process, and offer design tips for a successful outcome.

PCBAIR Upgrades Heavy-Copper PCBs to Solve AI Thermal Bottlenecks

01/20/2026 | PRNewswire
As computational demands for AI models surge, the hardware powering them faces a critical physical limitation: thermal management.
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