Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
Elementary, Mr. Watson: Why Your PCB Looks Like a Studio Apartment
The Shaughnessy Report: A Plan for Floor Planning
Digital Twin Concept in Copper Electroplating Process Performance
July 11, 2025 | Aga Franczak, Robrecht Belis, Elsyca N.V.Estimated reading time: 1 minute
Editor’s Note: This is an excerpt from a technical paper presented at the inaugural Pan European Design Conference in January 2025. It is reflected as originally presented with minor edits for grammar. There is a link to access the full paper at the conclusion of this excerpt.
Abstract
PCB manufacturing involves transforming a design into a physical board while meeting specific requirements. Understanding these design specifications is crucial, as they directly impact the PCB's fabrication process, performance, and yield rate. One key design specification is copper thieving—the addition of “dummy” pads across the surface that are plated along with the features designed on the outer layers. The purpose of the process is to provide a uniform distribution of copper across the outer layers to make the plating current density and plating in the holes more uniform.
Copper electroplating is crucial in PCB manufacturing, primarily because it reduces ground line impedance and voltage drop. The performance of the electroplating process directly affects the quality of the copper layer and related mechanical properties. In acid copper plating, achieving proper thickness distribution and surface uniformity without compromising metallurgical properties like elongation and tensile strength is challenging. Lowering the current density can help equalize copper thickness but significantly increases plating time, adversely affecting PCB throughput.
Therefore, controlling process performance and the quality of the electroplated copper layer are vital aspects of PCB plating, which remains challenging even for experienced PCB manufacturers. Recognizing plating process performance in terms of copper layer coverage and thickness up front adds significant value to process design and control. This paper explores the concept of automated copper thieving and the digital twin of the copper plating process in PCB manufacturing. These modern CAE tools facilitate the rapid assessment and mitigation of copper under- and over-plated surface areas, aligning closely with the principles of smart manufacturing.
To read the entire paper, which appeared in the June 2025 issue of PCB007 Magazine, click here.
Share on:
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Global PCB Connections: Understanding the General Fabrication Process—A Designer’s Hidden Advantage
08/14/2025 | Markus Voeltz -- Column: Global PCB ConnectionsDesigners don’t need to become fabricators, but understanding the basics of PCB fabrication can save you time, money, and frustration. The more you understand what’s happening on the shop floor, the better you’ll be able to prevent downstream issues. As you move into more advanced designs like HDI, flex circuits, stacked vias, and embedded components, this foundational knowledge becomes even more critical. Remember: the fabricator is your partner.
MKS’ Atotech to Participate in IPCA Electronics Expo 2025
08/11/2025 | AtotechMKS Inc., a global provider of enabling technologies that transform our world, announced that its strategic brands ESI® (laser systems) and Atotech® (process chemicals, equipment, software, and services) will showcase their latest range of leading manufacturing solutions for printed circuit board (PCB) and package substrate manufacturing at the upcoming 17th IPCA Show to be held at Pragati Maidan, New Delhi from August 21-23, 2025.
MKS Showcases Next-generation PCB Manufacturing Solutions at the Thailand Electronics Circuit Asia 2025
08/06/2025 | MKS Instruments, Inc.MKS Inc, a global provider of enabling technologies that transform our world, today announced its participation in Thailand Electronics Circuit Asia 2025 (THECA 2025), taking place August 20–22 at BITEC in Bangkok.
Point2 Technology, Foxconn Interconnect Technology Partner to Revolutionize AI Cluster Scalability with Terabit-Speed Interconnect
08/06/2025 | BUSINESS WIREPoint2 Technology, a leading provider of ultra-low-power, low-latency mixed-signal SoC solutions for multi-terabit interconnect, and Foxconn Interconnect Technology (FIT), a global leader in precision interconnect solutions, have signed a Memorandum of Understanding (MOU) to accelerate the commercialization of next-generation Active RF Cable (ARC) and Near Pluggable e-Tube (NPE) solutions.
Advancing Electrolytic Copper Plating for AI-driven Package Substrates
08/05/2025 | Dirk Ruess and Mustafa Oezkoek, MKS’ AtotechThe rise of artificial intelligence (AI) applications has become a pivotal force driving growth in the server industry. Its challenging requirements for high-frequency and high-density computing are leading to an increasing demand for development of advanced manufacturing methods of package substrates with finer features, higher hole densities, and denser interconnects. These requirements are essential for modern multilayer board (MLB) designs, which play a critical role in AI hardware. However, these intricate designs introduce considerable manufacturing complexities.