-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
From Silos to Systems: 2026 and Beyond
Welcome to the debut issue of I-Connect007 Magazine. This publication brings all of the pieces together from PCB design and fabrication for a closer alignment and a more integrated electronics manufacturing landscape.
Designing Proper Work-Life Balance
In this issue, we hear from designers, marketers, and business owners on how they apply their professional skills to their personal lives to build a healthier work-life balance.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
ICD Adds Matched Delay Optimization to Stackup Planner
June 20, 2016 | ICDEstimated reading time: 1 minute
In-Circuit Design Pty Ltd (ICD), Australia, developer of the ICD Stackup and PDN Planner software, has released a Matched Delay Optimization feature for the Stackup Planner.
Signals propagate at the speed-of-light in free space. However, this speed varies dramatically depending on the surrounding dielectric materials. Each layer, of a multilayer PCB, can have a very different propagation speed. This is particularly important for the latest high-speed DDR3/4 memory devices. The new “Matched Delay Optimization” feature, of the ICD Stackup Planner, allows you to not only match the length of busses, but takes this one step further by automatically calculating the appropriate length required to match the delay exactly. The integrated field solver simulates the flight time, of each signal layer, to quickly give you the results you need to effectively route memory.
“A matched length of 2.3 inches for a DDR3/4 Data lane can produce up to 70ps delta, between signal layers, leaving the timing way outside the required DDR3/4 setup and hold times,” said Barry Olney, CEO. “Designers need to pay strict attention to the signal propagation, on each layer, ensuring the total flight time of the critical signals match, regardless of length. The ICD Stackup Planner now allows you to optimize this delay."
The relative signal propagation is displayed as a bar graph, once the matched length has been set. Selecting “Matched Delay” automatically optimizes the length, of each signal layer, to match the maximum delay. The user can then route the data lane, to the exact delay, in their preferred design tool.
About In-Circuit Design Pty Ltd
In-Circuit Design Pty Ltd, based in Australia, developer of the ICD Stackup and PDN Planner software, is a PCB Design Service Bureau and specialist in board level simulation. Visit www.icd.com.au.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
ASC Sunstone Expands Online Quoting to Streamline Flex PCB Procurement
02/17/2026 | ASC Sunstone CircuitsAs demand for compact, lightweight, and high-reliability electronic designs continues to grow, ASC Sunstone is making it easier for engineers to source flex circuitry with Instant Online Quoting for select Flex PCB configurations through its OneQuote® platform at sunstone.com.
I-Connect007 Magazine: APEX EXPO 2026 Preview Plus AI Tools Designers Are Watching
02/17/2026 | I-Connect007 Editorial TeamThis month, I-Connect007 Magazine takes you inside APEX EXPO 2026, highlighting exhibitors and special events on the show floor, insights from the technical conference, updates on apprenticeships and keynotes, and progress in critical standards development. For PCB designers, we go beyond the dreaded auto-router, diving into practical AI-driven design tools that are actually shaping real-world workflows.
Cadence Launches ChipStack AI Super Agent for Next-Gen Chip Design
02/16/2026 | Cadence Design SystemsCadence announced a transformative step forward in redefining how semiconductors are designed with the launch of the ChipStack™ AI Super Agent—an agentic AI solution for front-end silicon design and verification.
American Standard Circuits Manufactures IC Substrate Designs Featuring 5–7 Stacked Microvias
02/13/2026 | American Standard CircuitsAmerican Standard Circuits (ASC), a leading U.S. manufacturer of advanced printed circuit board solutions, has successfully manufactured and shipped multiple IC substrate designs incorporating 5 to 7 stacked microvias using the company’s advanced Ultra High Density Interconnect (UHDI) manufacturing platform.
Astera Labs Opens Israel Design Center to Boost AI Connectivity Expansion
02/13/2026 | Astera Labs, Inc.Astera Labs, Inc., a leader in semiconductor-based connectivity solutions for rack-scale AI infrastructure, announced a significant expansion of its global engineering operations with the establishment of an advanced research and development center in Israel.