- smt007 Magazine
Latest IssuesCurrent Issue
This issue takes stock of the current economic outlook and how companies are using current conditions to move themselves through technological evolutions, workforce shifts, and financial changes. Even with these headwinds, there’s forward progress to be made.
- Events||| MENU
- smt007 Magazine
Indium Features Indium8.9HF, Indium10.1 Solder Pastes at NEPCON South ChinaJuly 13, 2016 | Indium Corporation
Estimated reading time: Less than a minute
Indium Corporation will feature its Indium10.1 and Indium8.9HF solder pastes at NEPCON South China 2016, on Aug. 30-Sept. 1, in Shenzhen, China.
Indium Corporation, the industry-leading source of void-reducing materials and results, has specifically formulated Indium10.1 solder paste to reduce voiding significantly below the industry average – for improved finished goods reliability. Indium10.1 delivers robust reflow capabilities and a wide processing window, which accommodates various board sizes and throughput requirements, and minimizes defects.
For a halogen-free option, Indium8.9HF solder paste delivers very low voiding. Its unique oxidation barrier technology makes it perfectly suited for a variety of applications, especially automotive assembly.
In addition to outstanding print transfer and excellent response-to-pause, Indium10.1 and Indium8.9HF both provide excellent pin-in-paste solderability and hole-fill.
For more information about Indium Corporation, click here.
AIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its new NC259FPA Ultrafine No Clean Solder Paste, which it revealed recently during the Productronica Germany trade show.
Real Time with... productronica 2023: Koh Young Discusses Semiconductor and Advanced Packaging Inspection11/27/2023 | Real Time with...productronica
Koh Young’s Harald Eppinger talks about the company’s technology for the semiconductor and advanced packaging market and how they address the challenges introduced by reflective components and micro solder deposits.
HyRel Technologies Attains ITAR Registration, Reinforcing Leadership in Robotic Solder Component Tinning11/27/2023 | HyRel
HyRel Technologies, a global provider of quick turn semiconductor modification solutions, announces the achievement of International Traffic in Arms Regulations (ITAR) registration.
Mek (Marantz Electronics), a leader in Automated Optical Inspection (AOI) solutions, used last weeks’ Productronica show in Munich to proudly introduce the SpectorBOX X series, a modular full 3D AOI system for THT solder joints and THT components.
Productronica 2023 played host to the IPC World Hand Soldering Competition, bringing talented regional solder champions from all over the globe to compete for the title of World Champion. Each competitor was given sixty minutes to assemble a complex printed circuit board with their performance judged in accordance with IPC-A-610 Class 3 criteria. Each competitor’s efforts were rated on the merits of the results achieved, scored on the quality of the assembly process, the electrical functionality of the assembly and the speed at which the assembly was produced.