-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Orange Co. Designers Council Meeting Draws A Packed House
September 6, 2016 | Judy Warner, I-Connect007Estimated reading time: 1 minute

On September 1, the Orange County Chapter of the IPC Designers Council filled the beautiful, modern presentation room at Alcon Labs in Irvine, California. (Thanks to Jay Wellman, PCB design supervisor at Alcon).
Speaker John Stine, VP of operations at Summit Interconnect’s Anaheim facility (parent company of KCA Electronics), gave a presentation on flex and rigid-flex design and fabrication. At least 75 electronics professionals listened as Stine, an expert in flex and rigid-flex technologies, discussed proper trace geometries, grounding, cover lay, adhesives, signal integrity, impedance control, book-bindings and much more in his 80-minute presentation.
The constant need to reduce size, weight and power (SWaP) is driving the increased use of flex materials, which are lighter than their rigid counterparts and can be folded (thus reducing the footprint), and flex eliminates the need for heavier cables for interconnects. This is especially applicable for the mil/aero and defense applications for which KCA has been specializing in for many years. Stine also illustrated how layering flex substrates with an internal stiffener can provide a very low-loss solution for high-speed applications (RF/microwave/MMW) in a way that rivals or exceeds the performance found in high speed rigid laminates.
The dialog between Stine and the designers stayed active throughout the lunch-and-learn presentation, and the content appeared to be very practical and immediately applicable to the attendees. Summit Interconnect CEO and President Shane Whiteside was in attendance and generously donated several raffle prizes on behalf of Summit/KCA, which were drawn at the end of the event.
I thoroughly enjoy these Designers Council meetings every time I attend. And a special thanks to Orange County Chapter President Scott McCurdy, who has been a tireless servant of our local design and electronics community. Those of us fortunate enough to live in SoCal continue to reap the benefits of his leadership. I’ll definitely be back to cover the next Designers Council meeting.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Mycronic Reports Strong Order Growth of 67% in Q3 2025
10/23/2025 | Mycronic ABMycronic AB has announced its interim results for January–September 2025, reporting robust order intake growth and continued strength across several divisions despite a temporary dip in quarterly net sales and EBIT margins.
STMicroelectronics Reports Q3 2025 Financial Results
10/23/2025 | Globe NewswireSTMicroelectronics N.V. , a global semiconductor leader serving customers across the spectrum of electronics applications, reported U.S. GAAP financial results for the third quarter ended September 27, 2025.
Kitron Posts Record Order Intake in Q3 2025
10/23/2025 | KitronKitron reported solid quarterly sales and profits combined with record order intake and backlog, particularly driven by growing demand from customers in the Defence/Aerospace market sector.
Standex Electronics Unveils New Brand Identity to Power the Next Era of Engineering Innovation
10/23/2025 | PRNewswireStandex Electronics, a business segment of Standex International Corporation and a global leader in precision-engineered electronic components, has unveiled a refreshed brand identity that represents the next evolution of its engineering excellence.
MacDermid Alpha Expands Laboratory Facilities in Thailand to Strengthen Regional Innovation and Customer Collaboration
10/23/2025 | MacDermid AlphaMacDermid Alpha Electronics Solutions, a global leader in chemicals and materials for electronic manufacturing, announced the opening of its expanded laboratory in Bangkok, Thailand.