Latest News
Ventec International Materials Certified to Latest IPC-4101 Revision E
07/11/2017 | Ventec International Group
Compunetics Obtains New MIL-PRF-31032 Certifications, Expands PCB Offerings
07/10/2017 | Compunetics
American Standard Circuits Promotes Mohammed Khan to Plant Manager
07/10/2017 | American Standard Circuits
Lenthor Engineering Invests in MicroCraft E4M6151 Flying Probe Test System
07/05/2017 | Lenthor Engineering
American Standard Circuits to Exhibit at SMTA Ohio Expo and Technology Forum
07/05/2017 | American Standard Circuits
American Standard Circuits Promotes Tim Hudson to Flex, Rigid-Flex and Special Products Manager
06/27/2017 | American Standard Circuits
FPCB Maker Ichia Records 17% YoY Growth in May Revenues
06/26/2017 | Stephen Las Marias, I-Connect007
TTM Technologies Received Fortive’s 2017 Outstanding Supplier Award
06/16/2017 | TTM Technologies, Inc.
Orbotech at JPCA 2017: Innovative Production Solutions for mSAP, Advanced HDI and Flex
06/09/2017 | Orbotech
Innovative Organic Foils for Remote Analysis of Chemical Compositions
06/08/2017 | Technische Universität Dresden
FPCB Maker Flexium Reports Nearly 5% YoY Growth in May Sales
06/07/2017 | Stephen Las Marias, I-Connect007
Meyer Burger Supplies CONx Microfab R&D and Pilot Production System at NextFlex
06/02/2017 | Meyer Burger
Intrinsiq Materials and NovaCentrix Unveil Ultra-Thin Printed Copper-Clad Polyimide using Photonic Sintering for HDI Applications
05/31/2017 | Intrinsiq Materials Inc.
Summit Interconnect Names Doug A. Scrimes VP and GM of Anaheim Division
05/30/2017 | Summit Interconnect, Inc.
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