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A Brief History of IPC APEX EXPO

In 1998, the Surface Mount Equipment Manufacturers Association (SMEMA) approached IPC for help. Because of IPC’s success with the Printed Circuits Expo and recognizing the need to establish control of its own event, the discussions between SMEMA and IPC ensued. This led to a merger between the two organizations and provided SMEMA with IPC member benefits.

Dan Beaulieu: It’s All About the Customer Experience

Dan Beaulieu is an industry expert in sales and marketing who understands the unique dynamics of working in both B2B and B2C efforts. Through his work with companies across the electronics manufacturing industry, Dan advocates for businesses to always deliver a top-notch customer experience. Customer experience may not stop world wars—or might it? Read on to get a perspective that only Dan Beaulieu can deliver.

Professional Development at IPC APEX EXPO 2024: From AI to DFM

The Professional Development Course program at IPC APEX EXPO 2024 will offer attendees a diversity of topics taught by new and returning instructors. Electronics industry professionals at any stage of their career will benefit. Thirty-two courses covering all aspects of the electronics manufacturing supply chain will be offered on Sunday, April 7, and Monday, April 8.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It may not officially be March Madness until March 17, but it feels pretty mad to me. Let’s just say it out loud: We are T-4 weeks to the IPC APEX EXPO. As I reviewed the big news of the week, I noticed quite a bit from mil/aero, and I recommend that you look for those headlines. But for now, I am more interested in the IPC Technical Conference and the ways that one engineer says you can get the most from your time spent at the show; Pete Starkey’s take on the world and European markets through the view of the EIPC keynote presenters; the reported growth in the global PCB market and the European EMS market; and what we are actually doing to remedy our workforce problems.

Electronics Circuit World Convention: A Brief History

In 1978, a new event called the Printed Circuit World Convention (PCWC) was born. It brought together printed wiring board (PWB) associations from around the world to focus on advancing technology, growing the market, and providing insight into the management of the manufacture of printed boards.

Real Progress Toward Solving U.S. Workforce Problems

IPC achieved a landmark in 2023 by creating an apprenticeship program approved by the U.S. Department of Labor. With such a registered framework in place, industry can work through IPC to secure local, state, and federal dollars for workforce development in a way they’ve never been able to do before. Cory Blaylock, director of workforce partnerships at IPC, has been instrumental in developing and moving this program toward adoption, and outlines what companies need to know to get involved.

Reassessing Surface Finish Performance for Next-gen Technology, Part 2

The introduction of 5G/6G has created a growing demand for faster rates of data transfer and operation at higher frequencies, pushing signals to travel toward the outer edges of conductors. As a result, the surface finish applied over the copper circuitry is now gaining more attention.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

I just finished counting the percentage of times in which artificial intelligence/machine learning/data analytics topics appeared in the I-Connect007 news this week. What do you think the percentage is? AI has moved well beyond a technical term; heck, it has clearly also eclipsed catch-phrase status. It seems a foregone conclusion that AI applications will be inserting themselves into manufacturing just as they are appearing in our handheld devices. Speaking of handhelds, that market seems to be growing as well. This week’s five must-reads include smartphone market data, telecom infrastructure development, a new white paper on the influence of data analytics, a report on the European market, and the launch of a new podcast series on PCB 3.0, a new design methodology.

Ups and Downs in the World Market

The keynote session for the EIPC 2024 Winter Conference addressed several topics, ranging from applications for superconductivity to the fluctuating European financial market and the importance of IC substrates. The conference took place in late January at the IHK Academie in the city of Villingen-Schwenningen, on the eastern edge of the Black Forest in southwest Germany. 

IPS Engineers on AI and More

Over the past few months, we have met several of IPS's team members. IPS has been a manufacturer of wet process equipment for printed circuit board fabrication for over 30 years, working from its Cedar City, Utah, location. In part one of this interview, you will meet IPS team members Travis Houchin, Larry Boehm, and Kaal Glazier. With this group of two seasoned industry experts and the voice of the next generation, we cover several topics, including AI, and some useful tips when considering equipment, especially in brownfield sites.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It was a good week in PCB design and manufacturing. In this week’s wrap-up, we have news about an uptick in EMS shipments in January, a look at the current M&A climate, some guidance on investing in your company in order to stay competitive, a primer on designing with embedded capacitance materials, and a roadmap for the industry to embrace sustainable PCBs in the future.

Catching Up With Industry M&A Expert Tom Kastner of GP Ventures

Every year or so, I like to chat with my friend, M&A expert Tom Kastner of GP Ventures. I know he has been busy the past few years, so I was anxious to find out more about it. He is the one person I know who really has his finger on the pulse of the industry. Tom has always been a great source of information for me and the industry as a whole.

Recycling PCBs: How NCAB is Navigating Challenges and Embracing Opportunities

In a recent article for Design007 about sustainable PCBs, my colleague Ramon Roche wrote about the various environmental regulatory requirements all of us have to meet every day. He emphasized that regulations are used as a starting point. He stated, “We also require our suppliers to comply with local social and environmental regulations and be ISO 9001 and ISO 14001 certified, where applicable.” The ambition to create sustainable printed circuit boards (PCBs) is a continuous effort, and no single regulation makes a complete solution. However, applying all these standards together can help to create the most sustainable PCB possible.

What PCB Fabricators Should Know About IPC APEX EXPO 2024

On the cusp of another IPC APEX EXPO, we focus on how bare board fabricators can maximize their time and investment at the show. We visited with Matt Kelly, IPC chief technologist, and Julia Gumminger, IPC professional development and events manager, as well as Udo Welzel and Stanton Rak, the chairs of the technical program committee, to discuss the technical depth and breadth that the 2024 show will bring to fabricators and professionals all along the supply chain.

John Mitchell Addresses Industry Workforce Challenges with U.S. Department of Commerce

IPC’s efforts in government relations and advocacy have been pivotal in getting legislation like the CHIPS Act passed. In February, IPC President and CEO Dr. John W. Mitchell was back in Washington, D.C., representing our industry in a meeting convened by the U.S. Department of Commerce, where he discussed workforce issues in our industry and how to ensure that our businesses have the workforce they need. In this audio interview, he reviews his concerns and solutions on workforce development.

RoBAT Brings TDR Test to Bare and Assembled PCBs

In an interview at DesignCon, Gregory Miczek, global applications manager with RoBAT, discussed the company’s background and its expansion path from backplane defect analyzers to TDR testers for high-tech bare and assembled boards.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

It’s been another busy week in the industry. We lost another old friend last week. The EIPC show happened, and Pete Starkey provided us with complete and compelling show coverage, from start to finish. Recently, we posed the question, “When is it time to introduce embedded components into your PCB design?” which was asked and answered by design aficionado Kris Moyers in the latest issue of Design007 Magazine. We are proud to be a part of the exciting Global Insights weekly newsletter, which Nolan Johnson and Brian Knier explored in their interview, and we rounded out the week with some big merger news. Here are my picks for the past week’s must-read news items.

EIPC Winter Conference 2024, Day 2: A Closer Look at Global Trends

The opening session of the second day’s conference proceedings focused on global PCB trends and was introduced and moderated by Dr. Michele Stampanoni, vice president of strategic sales and business development at Cicor Group in Switzerland. He opened the session with Dr. Hayao Nakahara’s knowledgeable and enlightening video presentation on the IC substrates industry.

IPC Global Insight Newsletter: It’s Happening Now, for You 

In this interview, Brian Knier, vice president and chief marketing officer at IPC, discusses the compelling reasons this newsletter is a must for a worldwide audience that wants to compete in this global marketplace. In this interview, Brian Knier, vice president and chief marketing officer at IPC, discusses the compelling reasons this newsletter is a must-read for a worldwide audience that wants to compete in this global marketplace. 

An Interview With Two Student Leaders at Auburn

At Auburn University in Alabama, I connected with both Shaheen Pouya, the newly elected IPC student chapter president, who is pursuing a PhD in industrial engineering, and Padmanava Choudhury, the outgoing IPC student chapter president, a graduate research assistant and a fifth-year PhD student in the Department of Mechanical Engineering. He is pursuing a doctoral degree in the reliability of electronics packaging.

Ventec: The Flexibility We Need in Standards-driven Manufacturing

Ventec International COO Mark Goodwin and technology ambassador Alun Morgan had quite a bit to say at productronica 2023 about slash sheets, IPC standards, and how to bring the PCB designer closer to the supplier. As Mark says, what matters to designers, manufacturers, and even consumers, is that the products meet compliance standards, such as REACH. They don’t need to know how something is built. They just want performance and availability.

EIPC Winter Conference 2024, Day 1: A Grab-bag of Technical Topics

The 2024 Winter Conference of the EIPC took place January 30 and 31 at the IHK Academie in Villingen-Schwenningen, Germany. The keynote session will be reported separately. Here is my review of the first day’s conference proceedings.

Celebrating the Impact of IPC Community

IPC Community recently celebrated its one-year anniversary and everyone is recognizing our efforts to celebrate the success between IPC and its members, and showcase the interesting and important work of this nonprofit trade association.

I-Connect007 Editor’s Choice: Five Must-Reads for the Week

With such an extremely newsy week, it was hard to select just five items you absolutely must read, but here goes. We have advocacy news from PCBAA and IPC, global market data on AI PC and GenAI smartphone hardware, a roundtable discussion on sales and marketing, a bookended pair of international milaero stories emphasizing a healthy aerospace industry, and an industry report on global semiconductor sales. 

The Designer and Manufacturer Must Be in Sync

It’s no industry secret that most PCB data packages sent to fabricators from designers cannot be built as-is. The finished boards often seem to work, despite a factory estimating what the designer wanted vs. what the documentation showed, then jointly rectifying issues through lengthy technical query (TQ) cycles. In general, everyone seems to be satisfied with this process, so why do we need to improve the designer/manufacturer relationship?
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