-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueRules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
Silicon to Systems: From Soup to Nuts
This month, we asked our expert contributors to weigh in on silicon to systems—what it means to PCB designers and design engineers, EDA companies, and the rest of the PCB supply chain... from soup to nuts.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
TTM Shines a Light on Optical Interconnect
April 24, 2017 | I-Connect007Estimated reading time: 2 minutes
Are embedded optics on PCBs set to make a breakthrough in the upcoming years? According to Dr. Craig Davidson, VP of Corporate Technology at TTM, it might be closer than you’d expect. In a recent interview with the I-Connect007 team, Craig outlines TTM’s current pursuit of high-volume manufacturing lines able to deliver embedded optical interconnect, what that would mean for the PCB industry, and why he thinks there will be manufacturing production capability by 2020.
Barry Matties: Craig, for context, tell us a little bit about the optical side of TTM and what you guys are doing there.
Craig Davidson: Sure. We’re engaged already with the optical groups of many large customers. As you probably know, there are optical products today that do not include onboard optical interconnect or inboard optical interconnect, but rather optical cables to the edge of the board. These include fiber connectors and transceivers embedded in connectors. TTM certainly supports networking companies with these kinds of products formally classified as optical.
What we’re really taking about here is the future as we bring optical signals on board, onto the printed circuit board directly embedded in the board for optical packages, line cards or backplanes.
Matties: Yes.
Davidson: The basic capability has been around for decades. I first got involved in it back in the year 2000 when there was a big push for onboard optical interconnect and just about every printed circuit board fabricator at the time was doing something around embedding fibers into boards. Many PCB fabricators have these kinds of processes. It’s relatively simple to do but it’s not a very happy solution.
You still have problems with 90° bends, for example, and the z-axis in the board, and you certainly have continuing difficulties associated with connectorizing the fibers. Also, importantly, is registration—making sure the fibers actually end up where they need to be. That’s a very difficult task. So those types of problems haven›t really been solved for a long time. The TTM team in Europe has been working on this for a long time now.
And you interviewed Marika Immonen on our team back in 2015, I believe. TTM now has technology we can offer that will allow embedded waveguides in boards. This includes polymer waveguides either buried inside a board or built-up on the board surface and with in-plane or 90° connectors. We›re working jointly with several consortia and individual companies to demonstrate this technology.
So that’s a brief history of where we have been and at least a little preview of what we can offer. TTM has a long experience of fabricating multimode waveguides for short-reach datacom applications. Now as silicon photonics at OEMs is pushing through, we are scaling technology to support their single-mode roadmaps. There we pursue both polymer- and glassbased waveguides. Polymers are very versatile, low cost and easy to fabricate, whereas glass provides low loss at the longer wavelengths and optical compliance with fibers. Single mode waveguides are looked at to provide complex routing between chips or to serve as “bridges” between sub-micron silicon waveguide and 9-micron fiber. In single mode, accuracy and registration both in waveguide fabrication and termination is critical.
To read the full version of this interview which appeared in the April 2017 issue of The PCB Magazine, click here.
Suggested Items
PI's New Expansion for Higher Electronics Manufacturing Capacities and Shorter Lead Times
11/20/2024 | PRNewswirePI, the market and technology leader for high-precision motion control, positioning technology, and piezo applications, has completed the construction of additional electronics production space at its Rosenheim, Germany site.
SMTA: Capital Chapter & Connecticut Chapter Joint Technical Webinar
11/12/2024 | SMTAThe SMTA Capital Chapter is co-hosting a free webinar for SMTA members with the SMTA Connecticut Chapter on Tuesday, November 19 at 11:00 a.m. EST.
2024 Stromberg Student Leader Scholarship Recipient Announced
11/05/2024 | SMTASMTA is pleased to announce Waad Tarman, Auburn University, has been selected as the recipient of the 2024 JoAnn Stromberg Student Leader Scholarship.
Indium Announces InnoJoin as Exclusive Global Sales Partner for NanoFoil®
11/04/2024 | Indium CorporationIndium Corporation announced that InnoJoin GmbH will be the exclusive global sales partner for NanoFoil® in component mounting applications. NanoFoil® is a leading nanotechnology material that delivers energy in a controlled and precise manner for joining, energetics, and heating applications.
Flexible Thinking: Musings on High Density Interconnections
10/30/2024 | Joe Fjelstad -- Column: Flexible ThinkingPeople have been using high density interconnection (HDI) technology since the early 1980s, although it was not called HDI until the late 1990s. In the 1970s, ’80s, and early ’90s, engineers used HDI methods to develop hybrid circuits, which were later referred to as multichip modules (MCMs). These were arguably the first instantiation of heterogeneous interconnection technology, which has been the industry buzzword for almost a decade. These devices are a way of integrating multiple chips—both integrated circuits and discrete devices (resistors, capacitors, and inductors)—into a single package, typically using ceramic substrates with layers of insulation and metallic inks (often gold) and firing them at high temperatures.