-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssuePower Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
iCD Launches QuickSolver Edition of Stackup Planner
May 24, 2017 | Barry Olney, In-Circuit DesignEstimated reading time: 1 minute
In-Circuit Design Pty Ltd (iCD), Australia, developer of the iCD Design Integrity software, has added the new iCD QuickSolver software to its growing product line.
“The iCD QuickSolver represents a price-performance breakthrough for field solver technology,” said iCD CEO Barry Olney. “The majority of digital designs these days require controlled impedance transmission lines. But few designers have access to an accurate field solver. We want to empower every PCB designer with this technology by offering a no-frills Stackup Planner at a very affordable price point.”
The iCD QuickSolver is an inexpensive edition of the popular iCD Stackup Planner that is powered by the same precision 2D BEM field solver and provides everything you need to accurately model the characteristic and differential impedance of multilayer PCBs utilizing blind and buried vias. You can also optionally add an Altium Designer bi-directional interface or license to a USB dongle to move the application between PCs.
iCD QuickSolver features include:
- 2D BEM field solver technology, the most affordable impedance control solution available
- Powerful inexpensive Stackup Planner, the industry-leading precision planner for eight signal/plane layers
- Ideal for independent designer, licensed to one PC or a USB dongle
- Characteristic impedance, edge-coupled and broadside-coupled differential impedance
- Dual build-up microstrip plus dual symmetric and asymmetric stripline
- Support for PTH plus blind and buried vias
- Automatically generates a fabrication drawing in Excel
- Optional Altium Designer bi-directional interface with design rules export
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
LPKF Joins productronica’s 50th Anniversary, Showcasing Laser Technology for Electronics Manufacturing
10/10/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics invites visitors to productronica 2025 in Munich from November 18 to 21. At booth 305 in hall B2, the company will present its portfolio of modern laser technologies for the electronics industry live – from prototyping systems and high-performance depaneling to laser plastic welding for electronic housings and thin glass processing for advanced packaging.
Marco Pieters Appointed ASML Chief Technology Officer
10/09/2025 | ASMLASML Holding NV (ASML) announced the appointment of Marco Pieters as Executive Vice President and Chief Technology Officer, reporting to President and Chief Executive Officer, Christophe Fouquet.
Advanced Rework Technology Inspires Students at National Manufacturing Day 2025
10/08/2025 | A.R.T. Ltd.Advanced Rework Technology Ltd. (A.R.T.), a leading independent IPC-accredited training provider, joined forces with Jaltek, a UK-based electronics manufacturer with over 35 years’ experience in designing and producing high-quality electronic products, to deliver hands-on workshops for students during National Manufacturing Day 2025.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.