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Current IssueIt's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
Fueling the Workforce Pipeline
We take a hard look at fueling the workforce pipeline, specifically at the early introduction of manufacturing concepts and business to young people in this issue of PCB007 Magazine.
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In this issue, we examine the critical nature of building precisions into your inner layers and assessing their pass/fail status as early as possible. Whether it’s using automation to cut down on handling issues, identifying defects earlier, or replacing an old line...
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EIPC SpeedNews: News from the European PCB Industry
February 15, 2018 | EIPCEstimated reading time: Less than a minute

- Review: EIPC Winter Conference Lyon
- Proceedings Conference Lyon Free of Charge by EIPC members
- New Date and Location of EIPC 50th Anniversary Conference: June 21–22, 2018, Geldern, Germany
- Smart Systems Integration 2018: Program Highlights for Visitors
- Cryptocurrency Craze Boosts Demand for Memory Chips
- DYCONEX Opts for Automated Guided Vehicles
- SCS Partners with DTI to Sponsor UK Electronics Industry at International Events
- 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12; First day at Merlin PCB, Deeside, and then at Chester University
- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at IPC APEX EXPO 2018
- Atotech to Present and Exhibit at the IPC APEX Expo 2018
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Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
03/07/2025 | VentecVentec International Group is delighted to announce the appointment of Chris Mundy as Commercial Director for EMEA & Americas.
Sunny Kwok Joins Ventec as Technical Sales Representative for UK and EMEA
02/14/2025 | VentecVentec is pleased to announce the appointment of Sunny Kwok as Technical Sales Representative for UK and EMEA regions. Sunny will further enhance service support levels for Ventec full range of materials including non-reinforced resin coated copper and film products (thermal/Pro-bond), high speed/low loss (tec-speed) and Ventec’s full range of halogen free materials for high reliability applications.
Ventec Confirms Thailand as Location for New State-of-the-Art PCB Material Manufacturing Facility
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