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Current IssueInventing the Future with SEL
Two years after launching its state-of-the-art PCB facility, SEL shares lessons in vision, execution, and innovation, plus insights from industry icons and technology leaders shaping the future of PCB fabrication.
Sales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
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EIPC SpeedNews: News from the European PCB Industry
February 15, 2018 | EIPCEstimated reading time: Less than a minute

- Review: EIPC Winter Conference Lyon
- Proceedings Conference Lyon Free of Charge by EIPC members
- New Date and Location of EIPC 50th Anniversary Conference: June 21–22, 2018, Geldern, Germany
- Smart Systems Integration 2018: Program Highlights for Visitors
- Cryptocurrency Craze Boosts Demand for Memory Chips
- DYCONEX Opts for Automated Guided Vehicles
- SCS Partners with DTI to Sponsor UK Electronics Industry at International Events
- 2018 ICT Annual Symposium, June 5, 2018, National Motor Museum
- 2018 Spring Seminar and AGM, Best Western Plus Manor Hotel, March 13, 2018
- Annual Foundation Course April 9–12; First day at Merlin PCB, Deeside, and then at Chester University
- Ventec to Showcase Thermal Management Solutions and Latest Laminate Technology at IPC APEX EXPO 2018
- Atotech to Present and Exhibit at the IPC APEX Expo 2018
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Ventec International Group Announces Distribution Agreement with Jinzhou Precision Technology Corporation
08/05/2025 | VentecVentec International Group has confirmed its agreement with Jinzhou Precision Technology Corporation to distribute precision drill and router bits in the Europe, Middle East, and Africa (EMEA) region, working in cooperation with DCM Technology, Jinzhou’s long standing European distribution partner.
Ventec International Group's Thailand New Plant Breaks Ground
08/04/2025 | Ventec International Group Co., Ltd.Ventec International Group Co., Ltd. held a groundbreaking ceremony on the morning of July 30th at the Hi-Tech Industrial Park in Ayutthaya, Thailand.
Ventec Strengthens Commitment to Halogen-Free PCB Manufacturing in Europe
06/11/2025 | Ventec International GroupVentec International Group, the PCB materials innovator, manufacturer, supplier and one-stop shop for copper clad laminates, prepregs, as well as process consumables and PCB manufacturing equipment has established volume inventory of halogen-free FR4.1 and FR15.1 PCB materials at its European hub in Germany.
Ventec International Group Enters into a Fulfillment and Supply Agreement with Matrix and Launches Ventec Americas
06/09/2025 | Ventec International GroupVentec is excited to announce a new partnership with Matrix aimed at enhancing the fulfillment, value-added conversion, and distribution of PCB base materials across the North American market. This collaboration is set to significantly improve supply chain efficiency, and delivery performance for the company's North American customers.
Dixon, Inventec Form JV for PC Manufacturing in India
05/05/2025 | DixonDixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.