-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueSales: From Pitch to PO
From the first cold call to finally receiving that first purchase order, the July PCB007 Magazine breaks down some critical parts of the sales stack. To up your sales game, read on!
The Hole Truth: Via Integrity in an HDI World
From the drilled hole to registration across multiple sequential lamination cycles, to the quality of your copper plating, via reliability in an HDI world is becoming an ever-greater challenge. This month we look at “The Hole Truth,” from creating the “perfect” via to how you can assure via quality and reliability, the first time, every time.
In Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
- Articles
- Columns
- Links
- Media kit
||| MENU - pcb007 Magazine
IPC Releases More Test Coupons for IPC-2221B Gerber Coupon Generator
May 23, 2018 | IPCEstimated reading time: 1 minute
IPC – Association Connecting Electronics Industries would like to announce the release of additional test coupons for the IPC-2221B Gerber Coupon Generator, an exclusive annual subscription service for IPC member companies. The IPC-2221B Gerber Coupon Generator subscription service is the only service providing new, industry approved test coupons addressing blind, buried, stacked and staggered via structures. The most commonly used coupons for product acceptance are “AB,” “AB/R” and “D” which were introduced in 2016.
The tool is now updated with new features and coupons as requested by our members including updated “B” and “D” Coupon designs that support not only through-hole but also stacked and staggered (a.k.a. “propagated”) structures featuring blind and buried vias. Designated sections of the “B” Coupon for both registration and structural integrity evaluations are now included. The new “H” Coupon design for evaluating surface insulation resistance (SIR) has been introduced as well as the new “S” Coupon design for evaluating through-hole solderability. Finally, the new “P” Coupon design for evaluating the peel strength of outer layer metallic foils has been added.
Additional coupon designs for surface mount solderability testing, moisture and insulation resistance (MIR) testing of laminated base materials and solder mask adhesion testing are slated for release later this year and will be incorporated into the subscription service free of additional charge.
The IPC-2221B Gerber Coupon Generator subscription service is a simple, easy-to-use Design Parameters/Input File, that utilizes an auto quality check feature, ensuring the design rules for the test designs are met. What used to take hours to generate Gerber files from the CAD/CAM user will now only take minutes.
The IPC-2221B Gerber Coupon Generator with the new designs is available as an annual subscription, meeting current printed board design parameters to generate Gerber Files of IPC-2221B Appendix A test coupon designs at any time. This allows users to generate coupons when they want, and as often as they need. To learn more, click here.
Suggested Items
Koh Young Appoints Tom Hattori as President of Koh Young Japan
07/21/2025 | Koh YoungKoh Young Technology, the global leader in True 3D measurement-based inspection solutions, announced the appointment of Tom Hattori as President of Koh Young Japan (JKY).
Silicon Mountain Contract Services Enhances SMT Capabilities with New HELLER Reflow Oven
07/17/2025 | Silicon Mountain Contract ServicesSilicon Mountain Contract Services, a leading provider of custom electronics manufacturing solutions, is proud to announce a significant upgrade to its SMT production capability with the addition of a HELLER 2043 MK5 10‑zone reflow oven to its Nampa facility.
Knocking Down the Bone Pile: Addressing End-of-life Component Solderability Issues, Part 4
07/16/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn 1983, the Department of Defense identified that over 40% of military electronic system failures in the field were electrical, with approximately 50% attributed to poor solder connections. Investigations revealed that plated finishes, typically nickel or tin, were porous and non-intermetallic.
SHENMAO Strengthens Semiconductor Capabilities with Acquisition of PMTC
07/10/2025 | SHENMAOSHENMAO America, Inc. has announced the acquisition of Profound Material Technology Co., Ltd. (PMTC), a premier Taiwan-based manufacturer of high-performance solder balls for semiconductor packaging.
KYZEN to Highlight Understencil and PCB Cleaners at SMTA Querétaro Expo and Tech Forum
07/09/2025 | KYZEN'KYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Querétaro Expo & Tech Forum, scheduled to take place Thursday, July 24, at Centro de Congresos y Teatro Metropolitano de Querétaro.