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Current IssueIn Pursuit of Perfection: Defect Reduction
For bare PCB board fabrication, defect reduction is a critical aspect of a company's bottom line profitability. In this issue, we examine how imaging, etching, and plating processes can provide information and insight into reducing defects and increasing yields.
Voices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
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EIPC SpeedNews: News from the European PCB Industry
October 1, 2018 | EIPCEstimated reading time: Less than a minute

- Alun Morgan Named Technology Ambassador for Ventec International Group
- Call for Papers: EIPC Winter Conference Milan, February 14–15, 2019
- Elmatica Welcomes Former Secretary of State and Cisco Director to the Board of Directors
- Taiwan Sees More Firms Willing to Move Production Back from China
- Audit Checklist Targets Fake Chips
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Ventec Presents Cutting Edge Innovations and High-performance Formulas at IPC APEX EXPO 2025
03/14/2025 | Ventec International GroupVentec International Group is presenting new substrate materials and proven formulas for high-performance PCBs at IPC APEX Expo 2025, alongside the latest advances in manufacturing equipment from Ventec Giga Solutions.
Ventec International Group Announce Launch of VT-47LT IPC4101 /126 Prepreg for HDI
03/12/2025 | Ventec International GroupVentec International Group announce launch of VT-47LT IPC4101 / 126 Prepreg. Are Microvia Failures Plaguing Your HDI Any Layer Designs? High-density interconnect (HDI) designs are pushing the envelope - higher layer count HDI relies on complex microvia designs: skip vias, staggered microvias, and stacked microvias in sequential laminations.
Chris Mundy Joins Ventec as Commercial Director for EMEA & Americas
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