-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current Issue
Power Integrity
Current power demands are increasing, especially with AI, 5G, and EV chips. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Signal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Words of Advice: Fabricator Feedback?
December 10, 2018 | I-Connect007 Research TeamEstimated reading time: Less than a minute
In a recent Design007 survey, we asked the following question: What is the most important feedback that you receive after your board is manufactured?
Here are just a few of the answers, edited slightly for clarity.
Scott McCurdy, Freedom CAD: We run all of our designs through Valor NPI, so we don’t have many problems get back to us. But more feedback from our customers would be helpful. We always like to hear when a customer is happy and the board worked the first time.
Dwain Strang, ZIN Technologies: What came up at first article checkout? How did everything go together? Was testing OK, and did it pass?
Alex Forbes, Rakon: That it works! Feedback from the manufacturer and the assembler.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Ynvisible Expands into South America Through Strategic Collaboration with ED Technologies
10/22/2025 | Ynvisible Interactive Inc.Ynvisible Interactive Inc., a leading provider of printed low-power e-paper display products, is pleased to announce a strategic partnership with ED Technologies to support market development across South America, with an initial focus on Brazil.
Würth Elektronik Participates in EU Initiative PROACTIF for Cutting-edge Drone and Robotics Solutions
10/14/2025 | Wurth ElektronikWürth Elektronik is a partner in the visionary EU project PROACTIF, funded under the Chips Joint Undertaking (Chips JU). The international consortium of 42 partners from 13 countries aims to strengthen Europe’s technological sovereignty i
Dymax to Address Key Electronics Assembly Challenges with Light-Cure Solutions at SMTA International 2025
10/09/2025 | DymaxDymax, a global manufacturer of light-curing materials and equipment, will exhibit at SMTA International 2025 in Rosemont, Illinois, October 21–23. Visit booth 2834 to see how Dymax technologies protect components from harsh environments, help meet regulatory requirements, and streamline assembly.
The Latest Issue: Advanced Electronics Packaging Digest to Explore Critical Minerals, Substrates, and Reliability Standards Driving Next-Gen Electronics
10/09/2025 | I-Connect007I-Connect007 is pleased to announce the upcoming issue of Advanced Electronics Packaging Digest (AEPD) on October 13, 2025, featuring expert insights on the technologies shaping the future of advanced packaging. As the electronics industry evolves, this issue takes a closer look at the materials, designs, and standards redefining performance and reliability across global markets.
The Power Integrity Issue: Design007 Magazine October 2025
10/08/2025 | I-Connect007 Editorial TeamAs technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.