The Shaughnessy Report: Zee Plane! Zee Plane!
Target Condition: Distribution of Power—Denounce the Ounce
Fresh PCB Concepts: Resilience and Renewal in Domestic PCB Manufacturing
The Power Integrity Issue: Design007 Magazine October 2025
October 8, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Power integrity wasn’t a big problem for most PCB designers until the 2000s, when power-hungry chips and features likewise forced the industry to take notice. But as technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Our featured contributors include Heidi Barnes of Keysight Technologies, Istvan Novak of Samtec, Zach Caprai of Siemens EDA, and columnists John Watson, Barry Olney, Kelly Dack, and Vern Solberg. We have a column by Matt Stevenson, and another article in a series by Anaya Vardya. Beth Massey of MacDermid Alpha Electronics Solutions discusses various potting compounds that can help manage issues such as CTE mismatch in RF applications.
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