Dan’s Biz Bookshelf: ‘Abundance: How We Build a Better Future’
Trouble in Your Tank: In Complex Systems, Design Rules Aren’t Optional
It’s Only Common Sense: The Phone Is Still Your Competitive Advantage
RTW IPC APEX EXPO 2019: Uyemura Discusses Heavy Gold Deposition
February 13, 2019 | Real Time with...IPCEstimated reading time: 1 minute
Richard DePoto, business development manager at Uyemura, brings Pete Starkey up to speed on the success of the heavy gold deposition process they discussed last year. Learn how it has been seamlessly integrated into standard ENEPIG lines to give a choice of finishes, and how advances in electroless palladium have enabled the elimination of electroless nickel for high-speed signal integrity.
To watch the interview, click here.
Share on:
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
Advanced Packaging for AI: Reliability Starts at the Cu/Cu/Cu Microvia Junction
04/20/2026 | Kuldip Johal, MKS' AtotechThe rapid growth of AI computing, from training clusters to inference at scale, is reshaping demand across the entire electronics supply chain. Advances in technology requirements, such as higher bandwidth, lower latency, and greater compute density, are driving the development of advanced packaging technologies and transforming the PCB industry across design, manufacturing, testing, and even architecture.
Trouble in Your Tank: Understanding Interconnect Defects, Part 2
12/03/2025 | Michael Carano -- Column: Trouble in Your TankPart 1 of this two-part series presented a more detailed look at the underlying causes of interconnect defects (sometimes known as interplane separation), with these three modes of interplane separation: Type 1: Separation of the electroless copper deposit from the interconnect; Type 2: Separation of the electrolytic copper deposit from the electroless copper deposit, but the electroless remains on the post; Type 3: Cohesive failure of the electroless, whereby the electroless copper deposit actually separates from itself.
Uyemura Opens Dedicated UBM and Prototype Plating Line at Southington Tech Center
11/25/2025 | UyemuraUyemura has commissioned a dedicated plating tool at its Southington, CT Tech Center that addresses 3 urgent needs.
Connect the Dots: The Future of Designing for Reality—Electroless Copper
11/26/2025 | Matt Stevenson -- Column: Connect the DotsOn a recent episode of I-Connect007’s On the Line With… podcast, we discussed electroless copper deposition—depositing a thin copper layer into the through-holes and vias of what will eventually become a printed circuit board. Specifically, it is a chemically catalyzed deposition of copper, mainly to the epoxy inside the holes (as well as on the entire surface of the board). Electroless differs from electrolytic in that electrolytic deposition relies on electricity.
Trouble in Your Tank: Understanding Interconnect Defects, Part 1
11/04/2025 | Michael Carano -- Column: Trouble in Your TankThis month, I’ll address interconnect defects (ICDs). While this defect continues to rear its ugly head, don’t despair. There are solutions, most of which center on process control and understanding the relationship of the chemistry, materials, and equipment. First, though, let’s discuss ICDs.