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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Cadence Webinar: Preventing EMC Problems in IC Package and PCB Designs
March 8, 2019 | Cadence Design Systems, Inc.Estimated reading time: Less than a minute
EMC compliance is required by all commercial electronic devices to ensure safety, compatibility, and reliable operation.
Cadence Sigrity technology provides fast and accurate design analysis and performance verification without the need of a physical prototype—giving you powerful early issue detection and streamlined resolution.
Join Cadence Education Services and signal integrity/power integrity (SI/PI) expert Srdjan Djordjevic on March 14, 2019, 16:00 CET, for a free one-hour live webinar to find out what SI/PI analysis tools can do for you.
The webinar will show you how to include EMC simulations and analysis early in the design stage to help avoid costly redesigns. The demo utilizes the Sigrity PowerSIand OptimizePI (frequency domain) tools to show how SI/PI analysis supports EMC analysis and uses post-processing steps to identify radiated emissions.
Cadence Sigrity technology supports all layout systems (Mentor, Zuken, Altium, Cadence Allegro, Cadence SiP, Cadence Allegro Package Designer, and others)—giving you maximum flexibility with optimal compatibility.
Testimonial
"In a year when every marketing dollar mattered, I chose to keep I-Connect007 in our 2025 plan. Their commitment to high-quality, insightful content aligns with Koh Young’s values and helps readers navigate a changing industry. "
Brent Fischthal - Koh YoungSuggested Items
OKI Develops 180-Layer, 15 mm PCB for AI Semiconductor Test Equipment
04/29/2026 | BUSINESS WIREOKI Circuit Technology, the OKI Group’s printed circuit board (PCB) business company, has successfully developed design and production technologies for 180-layer, 15 mm-thick PCBs intended for use in wafer testing equipment for high bandwidth memory (HBM) mounted on AI semiconductors.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
Indium Awarded $3.2 Million DOE Grant to Establish Domestic Gallium Supply Chain
04/28/2026 | Indium CorporationIndium Corporation announced it has been awarded a $3.2 million grant by the U.S. Department of Energy’s (DOE) Office of Critical Minerals and Energy Innovation (CMEI) to develop a domestic process for recovering high-purity gallium from manufacturing by-products—a critical step toward establishing a secure, domestic supply chain for a material essential to modern defense systems, semiconductors, and advanced electronics.
Roundtable: Advanced Materials
04/27/2026 | I-Connect007 Editorial TeamDriven largely by the need for advanced chip technology for super compute ability and AI applications, low Dk, low-loss resin systems, and heavy copper laminate are attracting significant attention and global resources. There are numerous unavoidable challenges in this market that will impact manufacturers and the supply chain, and they may be hitting critical mass sooner than OEMs and fabricators think. In this roundtable discussion, moderator Marcy LaRont speaks with topic experts: Mark Goodwin, John Fix, and Ed Kelley.
Silicon Box Joins imec Automotive Chiplet Program to Strengthen Next-Gen Vehicle Supply Chains
04/22/2026 | PRNewswireSilicon Box, an industry leader in advanced semiconductor packaging solutions, announced that it has formally joined imec's Automotive Chiplet Program (ACP), a collaborative research initiative aimed at accelerating chiplet technology adoption required to drive the development of next-generation vehicles.