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Suggested Items

IPC's Vision for Empowering PCB Design Engineers

04/30/2024 | Robert Erickson, IPC
As architects of innovation, printed circuit board designers are tasked with translating increasingly complex concepts into tangible designs that power our modern world. IPC provides the necessary community, standards framework, and education to prepare these pioneers as they explore the boundaries of what’s possible, equipping engineers with the knowledge, skills, and resources required to thrive in an increasingly dynamic field.

On the Line With… Talks With Cadence Expert on SI/PI for PCB Designers

05/02/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology—SI/PI for PCB Designers,” subject matter expert Brad Griffin, Cadence Design Systems, discusses how an intelligent system design methodology can move some signal and power integrity decision-making into the physical design space, offering real-time feedback. 

On the Line With... Podcast Talks With Cadence Expert on Manufacturing

04/18/2024 | I-Connect007
In “PCB 3.0: A New Design Methodology: Manufacturing” Patrick Davis returns to the podcast to talk about design rules. As design considerations become more and more complex, so, too, do the rulesets designers must abide by.

Designing Electronics for High Thermal Loads

04/16/2024 | Akber Roy, Rush PCB Inc.
Developing proactive thermal management strategies is important in the early stages of the PCB design cycle to minimize costly redesign iterations. Here, I delve into key aspects of electronic design that hold particular relevance for managing heat in electronic systems. Each of these considerations plays a pivotal role in enhancing the reliability and performance of the overall system.

What’s New in Design Education at IPC APEX EXPO?

04/11/2024 | Kelly Allen, IPC Training Manager
Kelly (Kel) Allen shares her thoughts on the educational offerings at IPC APEX EXPO and beyond. In this interview, she discusses some of the newest classes taking place during the conference in Anaheim, covering everything from design, fab, and assembly through mil/aero, test, and supply chain issues.
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