-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueLevel Up Your Design Skills
This month, our contributors discuss the PCB design classes available at IPC APEX EXPO 2024. As they explain, these courses cover everything from the basics of design through avoiding over-constraining high-speed boards, and so much more!
Opportunities and Challenges
In this issue, our expert contributors discuss the many opportunities and challenges in the PCB design community, and what can be done to grow the numbers of PCB designers—and design instructors.
Embedded Design Techniques
Our expert contributors provide the knowledge this month that designers need to be aware of to make intelligent, educated decisions about embedded design. Many design and manufacturing hurdles can trip up designers who are new to this technology.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - design007 Magazine
DAC to Co-Locate with SEMICON West in 2020
June 5, 2019 | Business WireEstimated reading time: 4 minutes
Laying the foundation for the future of the global electronics systems design ecosystem, SEMI and the Design Automation Conference (DAC) have announced that DAC and SEMICON West will co-locate in July, 2020 and July, 2021.
DAC’s sponsors, the Association for Computing Machinery Special Interest Group on Design Automation (ACM SIGDA) and the IEEE Council on Electronic Design Automation (IEEE CEDA), agreed to an initial two-year commitment with SEMI to co-locate DAC with SEMICON West.
SEMI, the industry association representing the global electronic product design and manufacturing supply chain, and the DAC sponsors signed a letter of intent establishing DAC as a co-located event at SEMICON West in San Francisco from 2020 through 2021. SEMI is the organizer and producer of SEMICON West as well as six additional global SEMICON conferences. DAC organizes its own technical conference and exhibit centered around electronic design and automation from chips to systems.
The co-location represents a game-changing combination of world-class technical programs and exhibitions designed to give engineering attendees a central event to network, attend technical sessions and get exposed to the latest vendor technologies from the entire design and manufacturing ecosystem.
“It’s a pleasure to announce that DAC, noted for more than 55 years for its technical excellence in design automation, will be co-located with SEMICON West,” said David Anderson, president of SEMI Americas. “With DAC co-located with SEMICON West, the link between electronic system and semiconductor design community and the electronic product manufacturing supply chain will become even stronger.”
“Co-location is mutually beneficial for both DAC and SEMICON West, providing our customers with a centralized location that enables them to gain broader exposure and expand connections across the entire design and manufacturing ecosystem,” said Nimish Modi, senior vice president, marketing & business development at Cadence.
“We are excited to see two major industry events collocating in San Francisco. It’s a win-win situation for our customers, SEMICON West and DAC. The collocated event will provide our customers access to a comprehensive range of design and manufacturing technologies. In addition, DAC will bring a brand-new audience to SEMICON West while DAC attendees and exhibitors will benefit from the additional executive management exposure of industry leaders that attend SEMICON West every year,” said Anne Cirkel, senior director of technology marketing for Mentor, a Siemens business.
“This is great news for our customers. The colocation of these events will provide our customers with access to all the leaders across the entire design and manufacturing supply chain and ecosystem at a single location and time, and it will create a broader and richer experience,” said Dave DeMaria, corporate vice president of marketing, Synopsys.
“DAC has been the premier conference in design and design automation industry for last 56 years. With this co-location, DAC continues to fulfill its mission of providing best values on system and chip designs in the full eco system to academic and industry attendees, and we look forward in IEEE CEDA to have a strong cooperation with SEMICON West in the next two years”, said David Atienza, president of IEEE CEDA.
“DAC looks forward to exploring our synergies over the next two years where electronic design and automation meets electronics manufacturing,” said Sharon Hu, ACM SIGDA chair.
About DAC
The Design Automation Conference (DAC) is recognized as the premier event for the design of electronic circuits and systems, and for electronic design automation (EDA) and silicon solutions. A diverse worldwide community representing more than 1,000 organizations attends each year, represented by system designers and architects, logic and circuit designers, validation engineers, CAD managers, senior managers and executives to researchers and academicians from leading universities. Close to 60 technical sessions selected by a committee of electronic design experts offer information on recent developments and trends, management practices and new products, methodologies and technologies. A highlight of DAC is its exhibition and suite area with approximately 200 of the leading and emerging EDA, silicon, intellectual property (IP) and design services providers. The conference is sponsored by the Association for Computing Machinery (ACM), and the Institute of Electrical and Electronics Engineers (IEEE), and is supported by ACM's Special Interest Group on Design Automation (ACM SIGDA).
About SEMI
SEMI connects more than 2,100-member companies and 1.3 million professionals worldwide to advance the technology and business of electronics design and manufacturing. SEMI members are responsible for the innovations in materials, design, equipment, software, devices, and services that enable smarter, faster, more powerful, and more affordable electronic products. Electronic System Design Alliance (ESD Alliance), FlexTech, the Fab Owners Alliance (FOA) and the MEMS & Sensors Industry Group (MSIG) are SEMI Strategic Association Partners, defined communities within SEMI focused on specific technologies. Since 1970, SEMI has built connections that have helped its members prosper, create new markets, and address common industry challenges together. SEMI maintains offices in Bangalore, Berlin, Brussels, Grenoble, Hsinchu, Seoul, Shanghai, Silicon Valley (Milpitas, Calif.), Singapore, Tokyo, and Washington, D.C.
Suggested Items
All-Inclusive: PRIDE Industries Helps Employees With Disabilities to Succeed
05/01/2024 | Sandy Gentry, IPCPRIDE Industries is the leading employer of people with disabilities and those with other barriers to employment in the United States, including veterans and former foster youth. The company offers job training, placement, on-the-job coaching, and skills development for independent living. It has held IPC membership since 2000. Read more about this unique business and its connection to the electronics manufacturing industry.
U.S. Companies Invest Heavily in Robots
04/30/2024 | IFRManufacturing companies in the United States have invested heavily in more automation: total installations of industrial robots rose by 12% and reached 44,303 units in 2023. Number one adopter is the car industry followed by the electrical and electronics sector.
Flex Receives Ericsson 2023 Supplier Sustainability Award
04/30/2024 | FlexEricsson recently awarded Flex with its 2023 Supplier Sustainability Award — the second time since 2021. The award recognizes the extended supply chain benefits from sustainable manufacturing operations in the Flex facility in Tczew, Poland, that runs on 100 percent renewable energy.
USPAE to Springboard U.S. Technology Forward
04/30/2024 | Marcy LaRont, PCB007 MagazineThe U.S. Partnership for Assured Electronics (USPAE) was launched as a nonprofit subsidiary of IPC in 2020, specifically to manage the DoD relationship and access to funding, and to develop a cooperative facility to develop UHDI capabilities in the U.S., not only for the defense sector, but for the whole of the U.S. electronics industry. It is a tall order, but industry veteran Joe O'Neil believes it will happen. Having been tasked with making the UHDI Capable Cooperative Production Facility (UCCPF) a reality, he provides an update on this important project for U.S. electronics manufacturing.
Real Time with… IPC APEX EXPO 2024: Insight into Summit Interconnect's Success
04/30/2024 | Real Time with...IPC APEX EXPOShane Whiteside, CEO of Summit Interconnect, discusses the company's recent recognition as one of the best PCB fabricators in the industry by receiving IPC's Peter Sarmanian award. Whiteside touches on the impact of changes in the marketplace, such as the Defense Production Act and presidential determination, on their growth. Whiteside also shares the company's focus on mechanical and data automation to enhance manufacturing processes and anticipates more automation and evolution in the industry.