Target Condition: Are Autorouters Friend or Foe?
Fresh PCB Concepts: Assembly Challenges with Micro Components and Standard Solder Mask Practices
Elementary Mr. Watson: Retro Routers vs. Modern Boards—The Silent Struggle on Your Screen
Meet Our Newest Columnists From NCAB Group
August 31, 2019 | I-Connect007Estimated reading time: 1 minute
Meet our newest I-Connect007 columnists from NCAB Group! Alifiya Arastu, Jeff Beauchamp, Ruben Contreras, and Harry Kennedy are field application engineers from NCAB Group's technical team. In their columns, they will explore fresh PCB concepts, including medical and telecommunications applications, topics related to RoHS, and much more.
Alifiya Arastu
Alifiya Arastu has been working with NCAB since 2018 and is an excellent resource for a fresh perspective on the world of PCBs. She recently graduated from Western Michigan University with a bachelor’s degree in aerospace engineering and is currently a field application engineer. Alifiya hopes to use this column as a channel to spread technological knowledge as well as provide her own informed views on PCB topics.
Jeffery Beauchamp
Jeffery Beauchamp started his career in the PCB industry in 2003 at PD Circuits. When NCAB Group acquired PD Circuits in 2012, he was instrumental in facilitating the transition working with the teams in China, Europe, and the U.S. With his PCB design, engineering, and production background, he is able to work with PCB customers providing optimal solutions. Jeffery is a field application engineer and a key member of NCAB Group’s Global Technical Council, which is responsible for continuing to stay abreast of emerging technologies.
Ruben Contreras
Ruben Contreras has been involved in the circuit board industry for more than 30 years. He has a long history of activity on the factory floor with participation in different levels of sales, production, and quality. Since 2017, Ruben has worked in the West region of NCAB Group’s USA division as a field application engineer, focusing on providing quality expertise in designing and producing PCBs.
Harry Kennedy
As a field application engineer at NCAB Group, Harry Kennedy helps design engineers and contract manufacturers alike design better PCBs. He focuses on design tradeoffs and product application in order to determine the best possible options. Harry learned how to design advanced PCBs while at his previous job as an applications and validation engineer at Texas Instruments. Harry received a bachelor’s in engineering from Ohio State University.
Read "Fresh PCB Concepts" in various I-Connect007 newsletters. Subscribe today!
Share on:
Suggested Items
S&K Aerospace Awarded Major Contract Under DLA Maritime Acquisition Advancement Program
07/02/2025 | BUSINESS WIRES&K Aerospace, LLC has been awarded a significant contract under the Defense Logistics Agency’s (DLA) Maritime Acquisition Advancement Program, managed by the U.S. Naval Supply Command - Weapon Systems Support (NAVSUP WSS) in Mechanicsburg, PA.
Green Circuits to Exhibit Full-Service Electronics Manufacturing Solutions at 2025 SMD Symposium
07/02/2025 | Green CircuitsGreen Circuits, a full-service Electronics Manufacturing Services (EMS) partner to leading OEMs, is pleased to announce its participation in the 2025 SMD Symposium, taking place August 5-7 at the Von Braun Center in Huntsville, Alabama.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
06/27/2025 | Nolan Johnson, I-Connect007While news outside our industry keeps our attention occupied, the big news inside the industry is the rechristening of IPC as the Global Electronics Association. My must-reads begins with Marcy LaRont’s exclusive and informative interview with Dr. John Mitchell, president and CEO of the Global Electronics Association. For designers, have we finally reached the point in time where autorouters will fulfill their potential?
Knocking Down the Bone Pile: Tin Whisker Mitigation in Aerospace Applications, Part 3
06/25/2025 | Nash Bell -- Column: Knocking Down the Bone PileTin whiskers are slender, hair-like metallic growths that can develop on the surface of tin-plated electronic components. Typically measuring a few micrometers in diameter and growing several millimeters in length, they form through an electrochemical process influenced by environmental factors such as temperature variations, mechanical or compressive stress, and the aging of solder alloys.
RTX, the Singapore Economic Development Board Sign MOU Outlining 10-year Growth Roadmap
06/20/2025 | RTXRTX and the Singapore Economic Development Board (EDB) have signed a Memorandum of Understanding (MoU) which outlines a 10-year roadmap to further long-term strategic collaboration in Singapore.