-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueThe Growing Industry
In this issue of PCB007 Magazine, we talk with leading economic experts, advocacy specialists in Washington, D.C., and PCB company leadership to get a well-rounded picture of what’s happening in the industry today. Don’t miss it.
The Sustainability Issue
Sustainability is one of the most widely used terms in business today, especially for electronics and manufacturing but what does it mean to you? We explore the environmental, business, and economic impacts.
The Fabricator’s Guide to IPC APEX EXPO
This issue previews many of the important events taking place at this year's show and highlights some changes and opportunities. So, buckle up. We are counting down to IPC APEX EXPO 2024.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - pcb007 Magazine
Atotech to present at the NEPCON JAPAN 2020 in Tokyo
January 7, 2020 | AtotechEstimated reading time: 1 minute
Atotech, a leading surface-finishing solutions provider, delivering chemistry, equipment, and service to support diverse end-markets such as mobile devices, computers, consumer electronics, the global automotive industries, and many others, will present at the 34th Electronics R&D, Manufacturing and Packaging Technology Expo – NEPCON JAPAN, Tokyo Big Sight Japan, on January 15th – 17th.
Visitors of the event are welcome to stop by the company’s booth W9-60 to discuss hot industry trends, latest product innovations and the company's development outlook for the coming year.
Atotech’s key highlights at NEPCON JAPAN include:
- vPlate® – New vertical continuous copper plating equipment for advanced HDI and IC substrate
- Polygon® PLB Line® – New desmear and electroless copper metallization equipment
- ViaKing® – A new enhanced graphite direct metallization process for flex and advanced base materials
- Printoganth® P2 – A new universal horizontal e’less Cu system for flex, flex-rigid, HDI & MLB base materials
- InPro® SAP3 – IC substrate via filling process for best uniformity at high current density
- InPro® PI – Copper pillar plating process for high interconnect density
- PallaBond® – A new direct pure EPAG surface finish for ultra-fine L/S application
- Stanna-COF – Immersion tin process for chip-on-film applications
- CovaBond® P100 – Adhesion promoter for plating on polyimide COF, flex HDI, mSAP, SAP
- Novabond® EX – A new generation adhesion promoter for advanced IC substrate manufacturing
- AgPrep® – Ultimate non-etching adhesion promoter for silver surfaces
- Argalin® XL – High performance inorganic and Cr(VI)-free silver anti-tarnish process
- Spherolyte® UF3 – High speed copper deposition for pillar applications
- Xenolyte® NI TR – High temperature resistant Ni for RDL and pad metallization
For more information about Atotech or its product offering, please visit www.atotech.com or contact us at: info@atotech.com.
About Atotech:
Atotech is a global leader in surface-finishing solutions. Through a comprehensive systems-and-solutions approach, the company delivers chemistry, equipment, and service to support diverse industries such as consumer electronics, especially mobile devices and computers; global automotive; communication infrastructure; and many other industrial end-markets. Atotech’s relentless R&D efforts and global TechCenter presence allows it to deliver pioneering and sustainable products combined with unparalleled on-site customer support – making Atotech a critical partner to over 8,000 customers worldwide. Atotech is a team of 3,800 experts in over 40 countries generating annual revenues of $1.2 billion (2018). Atotech has manufacturing operations across Europe, the Americas, and Asia and its headquarters is located in Berlin, Germany.
Suggested Items
The Chemical Connection: Reducing Etch System Water Usage, Part 2
05/02/2024 | Don Ball -- Column: The Chemical ConnectionIn my last column, I reviewed some relatively simple ways to reduce water usage in existing etch systems: cutting down cooling coil water flow, adding chillers to replace plant water for cooling, lowering flow rate nozzles for rinses, etc. This month, I’ll continue with more ways to control water usage in your etcher. Most of these are not easily retrofittable to existing equipment but should be given serious consideration when new equipment is contemplated. With the right combination of add-ons, it is possible to bring the amount of water used in an etch system to almost zero.
Designer’s Notebook: What Designers Need to Know About Manufacturing, Part 2
04/24/2024 | Vern Solberg -- Column: Designer's NotebookThe printed circuit board (PCB) is the primary base element for providing the interconnect platform for mounting and electrically joining electronic components. When assessing PCB design complexity, first consider the component area and board area ratio. If the surface area for the component interface is restricted, it may justify adopting multilayer or multilayer sequential buildup (SBU) PCB fabrication to enable a more efficient sub-surface circuit interconnect.
Insulectro’s 'Storekeepers' Extend Their Welcome to Technology Village at IPC APEX EXPO
04/03/2024 | InsulectroInsulectro, the largest distributor of materials for use in the manufacture of PCBs and printed electronics, welcomes attendees to its TECHNOLOGY VILLAGE during this year’s IPC APEX EXPO at the Anaheim Convention Center, April 9-11, 2024.
ENNOVI Introduces a New Flexible Circuit Production Process for Low Voltage Connectivity in EV Battery Cell Contacting Systems
04/03/2024 | PRNewswireENNOVI, a mobility electrification solutions partner, introduces a more advanced and sustainable way of producing flexible circuits for low voltage signals in electric vehicle (EV) battery cell contacting systems.
Heavy Copper PCBs: Bridging the Gap Between Design and Fabrication, Part 1
04/01/2024 | Yash Sutariya, Saturn Electronics ServicesThey call me Sparky. This is due to my talent for getting shocked by a variety of voltages and because I cannot seem to keep my hands out of power control cabinets. While I do not have the time to throw the knife switch to the off position, that doesn’t stop me from sticking screwdrivers into the fuse boxes. In all honesty, I’m lucky to be alive. Fortunately, I also have a talent for building high-voltage heavy copper circuit boards. Since this is where I spend most of my time, I can guide you through some potential design for manufacturability (DFM) hazards you may encounter with heavy copper design.