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DesignCon 2025, Day 2: It’s All About AI

01/30/2025 | Marcy LaRont, I-Connect007
It’s hard to get away from the topic of artificial intelligence, but why would you? It’s everywhere and in everything, and my time attending presentations about AI at DesignCon 2025 was well worth it. The conference’s agenda featured engaging presentations and discussions focused on the technological advancements in AI, big data centers, and memory innovations, emphasizing the critical relationship between processors and circuit boards.

Beyond Design: Electro-optical Circuit Boards

01/22/2025 | Barry Olney -- Column: Beyond Design
Predicting the role of PCB designers in 10 years is a challenge. If only I had a crystal ball. However, we know that as technology progresses, the limitations of copper PCBs are increasingly apparent, particularly regarding speed, bandwidth, and signal integrity. Innovations such as optical interconnects and photonic integrated circuits are setting the stage for the next generation of PCBs, delivering higher performance and efficiency. The future of PCB design will probably incorporate these new technologies to address the challenges of traditional copper-based designs.

Designers Notebook: Impact of Advanced Semiconductor Packaging on PCB Stackup

01/07/2025 | Vern Solberg -- Column: Designer's Notebook
To accommodate new generations of high I/O semiconductor packaging, printed circuit board fabrication technology has had to undergo significant changes in both the process methods and the criteria for base material selection and construction sequence (stackup). Many of the new high-function multi-core semiconductor package families require more terminals than their predecessors, requiring a significantly narrower terminal pitch. Interconnecting these very fine-pitch, high I/O semiconductors to the PCB is made possible by an intermediate element referred to as an interposer.

BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4

01/02/2025 | I-Connect007
In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.

Connect the Dots: Designing for Reality—Solder Mask and Legend

01/02/2025 | Matt Stevenson -- Column: Connect the Dots
In the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
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