-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueBox Build
One trend is to add box build and final assembly to your product offering. In this issue, we explore the opportunities and risks of adding system assembly to your service portfolio.
IPC APEX EXPO 2024 Pre-show
This month’s issue devotes its pages to a comprehensive preview of the IPC APEX EXPO 2024 event. Whether your role is technical or business, if you're new-to-the-industry or seasoned veteran, you'll find value throughout this program.
Boost Your Sales
Every part of your business can be evaluated as a process, including your sales funnel. Optimizing your selling process requires a coordinated effort between marketing and sales. In this issue, industry experts in marketing and sales offer their best advice on how to boost your sales efforts.
- Articles
- Columns
Search Console
- Links
- Events
||| MENU - smt007 Magazine
CyberOptics to Discuss 3D Inspection for Advanced Packaging at SEMICON Taiwan
November 25, 2021 | CyberOptics CorporationEstimated reading time: 1 minute
CyberOptics Corporation, a leading global developer and manufacturer of high-precision 3D sensing technology solutions will share a technical presentation at the Heterogeneous Integration Global Summit organized by SEMICON Taiwan December 1-3, 2021. The company will also exhibit in WaferSense® and ReticleSense® sensors and feature the WX3000™ Metrology and Inspection system in booths I3128, L0310, J2434 and K2106 at TaiNEX 1, Taipei, December 28-30, 2021.
Dr. Charlie Zhu, Director of Engineering at CyberOptics, will present ‘3D Inspection Is Becoming Essential in Advanced Packaging’ in the AP technical track on December 2nd at 3:30 p.m. local time.
Advanced Packaging continues to be among the most dynamic and rapidly evolving areas of semiconductor development and manufacturing. Most of these new processes take advantage of the third dimension, going vertical to continue packing more computing power into less space while circumventing the difficulties posed by further reductions in two-dimensional size.
As the processes and features they create have become smaller and more complex, manufacturers face an increasing need for high-precision inspection and measurement to detect defects and improve process control. As a result, the traditional 2D-based inspections can no longer satisfy the needs for quality control where 3D inspection is becoming essential. A growing number of applications in the AP process are requiring full 3D inspection instead of sampling and the trend is expected to continue. However, the traditional 3D inspection systems are either slow or inaccurate which means they are unable to meet the growing demand of AP.
This presentation will elaborate on the needs and challenges of 3D inspection in various AP applications such as Wafer-Level Packaging (WLP), System-in-Package (SiP) and Substrate Inspection, and how CyberOptics’ disruptive Multi Reflection Suppression™(MRS™) sensor technology can improve yields, processes and quality.
At the show, the company will feature the WX3000™ Metrology and Inspection system powered by the 3 µm NanoResolution MRS sensor that provides sub-micrometer accuracy on features as small as 25µm. The system is specifically designed for wafer-level and advanced packaging applications. While retaining its ability to reject spurious multiple reflections, it adds the ability to capture and analyze specular reflections from shiny surfaces of solder balls, bumps and pillars, allowing highly accurate inspection and metrology of these critical packaging features. Fast, 100% 3D/2D inspection and metrology can be conducted with throughput greater than 25 wafers (300mm) per hour, 2-3X faster than alternative solutions.
For more information, visit www.cyberoptics.com.
Suggested Items
Taiyo Circuit Automation Installs New DP3500 into Fuba Printed Circuits, Tunisia
04/25/2024 | Taiyo Circuit AutomationTaiyo Circuit Automation is proud to be partnered with Fuba Printed Circuits, Tunisia part of the OneTech Group of companies, a leading printed circuit board manufacturer based out of Bizerte, Tunisia, on their first installation of Taiyo Circuit Automation DP3500 coater.
Vicor Power Orders Hentec Industries/RPS Automation Pulsar Solderability Testing System
04/24/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, is pleased to announce that Vicor Power has finalized the purchase of a Pulsar solderability testing system.
AIM Solder’s Dillon Zhu to Present on Ultraminiature Soldering at SMTA China East
04/22/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce that Dillon Zhu will present on the topic: Ultraminiature Soldering: Techniques, Technologies, and Standards at SMTA China East. This event is being held at the Shanghai World Expo Exhibition & Convention Center from April 24-25.
AIM to Highlight NC259FPA Ultrafine No Clean Solder Paste at SMTA Wisconsin Expo & Tech Forum
04/18/2024 | AIMAIM Solder, a leading global manufacturer of solder assembly materials for the electronics industry, is pleased to announce its participation in the upcoming SMTA Wisconsin Expo & Tech Forum taking place on May 7 at the Four Points by Sheraton | Milwaukee Airport, in Milwaukee, Wisconsin.
Hentec/RPS Publishes an Essential Guide to Selective Soldering Processing Tech Paper
04/17/2024 | Hentec Industries/RPS AutomationHentec Industries/RPS Automation, a leading manufacturer of selective soldering, lead tinning and solderability test equipment, announces that it has published a technical paper describing the critical process parameters that need to be optimized to ensure optimal results and guarantee the utmost in end-product quality.