-
- News
- Books
Featured Books
- smt007 Magazine
Latest Issues
Current IssueMoving Forward With Confidence
In this issue, we focus on sales and quoting, workforce training, new IPC leadership in the U.S. and Canada, the effects of tariffs, CFX standards, and much more—all designed to provide perspective as you move through the cloud bank of today's shifting economic market.
Intelligent Test and Inspection
Are you ready to explore the cutting-edge advancements shaping the electronics manufacturing industry? The May 2025 issue of SMT007 Magazine is packed with insights, innovations, and expert perspectives that you won’t want to miss.
Do You Have X-ray Vision?
Has X-ray’s time finally come in electronics manufacturing? Join us in this issue of SMT007 Magazine, where we answer this question and others to bring more efficiency to your bottom line.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - smt007 Magazine
Teledyne’s New High-resolution Multispectral Line Scan Camera Extends Defect Detection Beyond the Surface
April 5, 2022 | Globe NewswireEstimated reading time: 1 minute
Teledyne DALSA, a Teledyne Technologies company, is pleased to announce the release of its multispectral Camera Link HS (CLHS) line scan camera—a new model of the award-winning Linea product line. This latest high resolution line scan camera provides spectrally independent RGB and NIR outputs making it uniquely capable of handling some of the most challenging inspection applications by detecting defects both on and under the surface of a wide variety of materials, components, and products.
“The Linea ML 8k multispectral camera offers versatile capabilities to meet the increasingly demanding requirements of a number of today’s challenging inspection applications, like banknotes, passports, and other high security print,” said Xing-Fei He, Senior Product Manager at Teledyne DALSA. “In addition, we have been able to deliver spectrally independent outputs of the RGB and NIR channels which enables accurate defect detection both on and under the surface of products like semiconductor wafers and printed circuit boards (PCBs) in a single scan, greatly simplifying vision system designs.”
The Linea ML 8k multispectral camera uses Teledyne DALSA’s latest CMOS 8k quad linear sensor with a 5x5 ?m pixel size and delivers a maximum line rate of 70 kHz x 4 using CLHS fibreoptic interface. The camera also has built-in SFP+ transceivers that convert electrical signals to optical signals and connects directly to fibreoptic cables using LC connectors. Combined with the Teledyne DALSA Xtium™2 CLHS series of high-performance frame grabbers, the Linea ML 8k multispectral camera, like all of the Linea ML cameras, represent a breakthrough in data throughput in the industry.
Key Features:
- Teledyne DALSA’s newest CMOS quadlinear sensor
- Spectrally independent RGB and NIR outputs for accurate detection of defects without spectral interference
- Independent exposure control for each channel for better white balancing
- Works seamlessly from max speed to stop conditions
- Next generation Camera Link HS interface with field-proven data reliability
- Direct connection to fibreoptic cables for extended cable lengths up to 300 meters
Suggested Items
IPC Launches New Wire Harness Design Course Led by Defense Industry Expert
06/03/2025 | I-Connect007 Editorial TeamIPC is expanding its educational offerings with a new online course designed to provide foundational knowledge in wire harness and cable design. The course, Introduction to Wire Harness Design I, is led by a seasoned mechanical engineer and subject matter expert in military cable systems working at FNSS Defense Systems in Turkey.
Meyer Burger Files for Insolvency for German Subsidiaries
06/02/2025 | Meyer BurgerThe German subsidiaries of Meyer Burger Technology AG, Meyer Burger (Industries) GmbH and Meyer Burger (Germany) GmbH, have each filed for insolvency proceedings.
See TopLine’s Next Gen Braided Solder Column Technology at SPACE TECH EXPO 2025
05/28/2025 | TopLineAerospace and Defense applications in demanding environments have a solution now in TopLine’s Braided Solder Columns, which can withstand the rigors of deep space cold and cryogenic environments.
Incap UK Invests in SMT Technology as Part of Long-Term Operational Development
05/23/2025 | IncapIncap Electronics UK has completed the second phase of SMT (surface-mount technology) production lines upgrade at its facility in Newcastle-under-Lyme.
SEMI, Purdue University Launch AI and Data Analysis Online Courses
05/22/2025 | SEMISEMI, the industry association serving the global semiconductor and electronics design and manufacturing supply chain, today announced it has partnered with Purdue University to launch an online course series focused on artificial intelligence (AI) and data analysis techniques for the semiconductor industry.