-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
September 2022 Issue of Design007 Magazine Available Now
September 9, 2022 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute

In our August issue of SMT007 Magazine, "supply pain management" was the topic of discussion. This reminds us of the question that doctors often ask: “What’s your pain level on a scale of 1–10?”
Designers and design engineers have learned to navigate this supply chain craziness, snatching up components that are in short supply or making do with lower-tech parts that are available.
Supply chain management is a dynamic situation, with a number of global forces that can create pain for PCB designers. In this issue, we speak with a variety of experts and bring you up-to-the-minute insight about designing PCBs in this ever-changing environment. Take a breath and prepare to work through the supply pain as you flip through the pages of this month's Design007 Magazine.
Download your PDF copy today for future reference.
Subscribe here for our email notification direct to your inbox each month.
Suggested Items
Indium, Rio Tinto Announce Groundbreaking Milestone in Gallium Extraction Partnership
05/07/2025 | Indium CorporationIndium Corporation and Rio Tinto announced the successful extraction of gallium from feed sourced at Rio Tinto’s Vaudreuil alumina refinery in Saguenay, Quebec, Canada. This achievement highlights the power of collaboration in building a more robust global supply chain for gallium.
Navigating Global Manufacturing in an Era of Uncertainty
05/07/2025 | Philip Stoten, ScoopThe EMS industry faces unprecedented challenges as global trade tensions rise and tariff announcements create market uncertainty. In an overview of IPC Europe’s podcast, MADE IN EUROPE, industry experts from GPV and Zollner examine how these developments impact our businesses and customers, and what strategies will prevail in this new landscape.
The Government Circuit: Trump’s Trade War Disrupts the Electronics Ecosystem
05/06/2025 | Chris Mitchell -- Column: The Government CircuitThere is certainly no shortage of work to be done in the IPC Government Relations department, as the U.S. waged a tariff campaign on practically every industrial country in the world and several countries embarked on high-tech initiatives with a mix of approaches to the crucial foundations of electronics manufacturing. Indeed, the breadth and speed of U.S. President Donald Trump’s tariff campaign continues to be a serious challenge for our industry.
Taiwan's PCB Industry Chain Is Expected to Grow Steadily by 5.8% Annually in 2025
05/05/2025 | TPCAAccording to an analysis report jointly released by the Taiwan Printed Circuit Association (TPCA) and the Industrial Technology Research Institute's International Industrial Science Institute, the total output value of Taiwan's printed circuit (PCB) industry chain will reach NT$1.22 trillion in 2024, with an annual growth rate of 8.1%.
Dixon, Inventec Form JV for PC Manufacturing in India
05/05/2025 | DixonDixon has entered into Joint Venture Agreement (JV Agreement) with Inventec. Pursuant to the said JV Agreement, Dixon IT Devices Private Limited (JV Company) will be 60% owned by Dixon and 40% owned by Inventec.