-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Sunstone and I-007eBooks Launch Book on Designing for Reality
October 24, 2022 | I-Connect007Estimated reading time: 1 minute

I-007eBooks is excited to announce the release of the latest title in its series for designers, The Printed Circuit Designer’s Guide to… Designing for Reality.
This book covers both written and unwritten rules for how to create a realistic, manufacturable design.
Written by topic expert Matt Stevenson of Sunstone Circuits, this book covers the complete circuit board manufacturing process, taking readers on a virtual tour of the printed circuit manufacturing process, from choosing the right CAD tool, to additive/subtractive processes, and even touching on the art of PCB design.
Peer reviewer Duane Benson of Screaming Circuits, says, “I find that having a better understanding of the underlying process helps me create higher quality electronic designs. In this book, Matt Stevenson does a fantastic job of opening the hood and giving the reader that knowledge of the PC board fab process.”
Download your free copy today at I-007eBooks.com/dfr. You can also view our full library at I-007eBooks.com.
Dedicated to educating PCB designers, The Printed Circuit Designer’s Guide to… series of books is a valuable resource for people seeking the most relevant information available.
Look for other exciting titles, like:
- The Evolving PCB NPI Process
- Thermal Management with Insulated Substrates
- Stackups: The Design within the Design
- High Performance Materials
- System Analysis: Electromagnetic Interference and Thermal Analysis of Electronic Systems
- …and more coming this fall
We hope you enjoy The Printed Circuit Designer’s Guide to… Designing for Reality.
For more information, contact:
Barb Hockaday
I-Connect007 eBooks
barb@iconnect007.com
+1-916-365-1727
Suggested Items
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.
Happy’s Tech Talk #38: Novel Metallization for UHDI
05/07/2025 | Happy Holden -- Column: Happy’s Tech TalkI have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.
Elma’s AI Optimized CompacFrame Speeds Development of Rugged GPU-focused Applications
05/05/2025 | Elma ElectronicElma Electronic has expanded its line of SOSA aligned CompacFrame development chassis to include an AI (artificial intelligence) optimized 7-slot version.