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I-Connect007 Editor’s Choice: Five Must-Reads for the Week

06/14/2024 | Nolan Johnson, PCB007
This week’s must-reads are comprised of news which moves the industry forward. We’ve had quite a lot of news on a global scale, and they’re all good reads. To winnow down to just five, I chose either new information or interesting takes on ongoing industry stories. To that end, we have news about new capital equipment for advanced packaging, discussions of material selection and the imaging process during PCB fabrication, a columnist's ode to the best engineer she knows, and some optimistic news from the semiconductor industry.

Technology Days 2024 at Rehm: #opentochange

06/14/2024 | Rehm Thermal Systems
“The only constant is change” – this is particularly true in electronics manufacturing. In an industry that is constantly evolving and changing, it is crucial to be open to change.

IPC Masters 2024 Aims to Enhance Operator Skills in China

06/14/2024 | IPC
To meet the needs of China's electronics industry, IPC Asia and Pudong New Area Association For Quality And Technology Shanghai, will jointly organize a comprehensive skill competition event called IPC Masters 2024 in Shanghai, China.

Creation Technologies Celebrates 25 Years of Membership with SMTA

06/13/2024 | SMTA
At Creation Technologies, we’re thrilled to celebrate a significant milestone: 25 years of membership with the Surface Mount Technology Association (SMTA).

IPC Hosts Advanced Packaging Symposium in Tokyo

06/13/2024 | IPC
The IPC Advanced Packaging Symposium held in Tokyo on June 7, 2024, brought together leading experts, policy makers and other stakeholders from the semiconductor industry to discuss cutting-edge advancements and collaborative strategies shaping the future of advanced packaging technologies.
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