-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
Cadence’s Allegro X AI Offers 10X Reduction in Turnaround Time
April 6, 2023 | Cadence Design Systems, Inc.Estimated reading time: 1 minute

Cadence Design Systems has announced the Cadence Allegro X AI technology, a next-generation system design technology that offers revolutionary improvements in performance and automation. The new AI offering is built on and accessed through the Allegro X Design Platform and offers transformative time savings for PCB design, with placement and routing (P&R) tasks reduced from days to minutes and with equivalent or higher quality compared with manually designed boards.
P&R in PCB design is traditionally a manual time-intensive process that impacts time-to-market. The Allegro X AI technology leverages the scalability of the cloud for physical design automation, offering generative design of the PCB while ensuring the design is electrically correct and manufacturable. The new technology automates placement, metal pouring, and critical net routing, and is integrated with fast signal integrity and power integrity analysis. Using the generative AI capabilities, customers can streamline their system design process achieving a 10X or more reduction in PCB design turnaround time.
The Allegro X AI technology enables the following benefits:
- Improved Productivity: Dramatic reduction in design turnaround time by automating placement, leveraging a scalable architecture that uses compute infrastructure on the cloud.
- Better Quality of Results: Placement automation using generative AI enables feasibility analysis in the early phases of design. Exploring a much larger solution space than what is possible through manual methods, the technology drives optimization of metrics such as shorter wire lengths while adhering to the design constraints.
- Efficient Design Closure: Integrated tightly with system analysis technologies through the Allegro X Platform where the user can optimize the designs for electrical and thermal performance.
“Cadence is committed to delivering system design solutions that incorporate the power of AI and cloud technology to ensure the fastest turnaround times,” said Michael Jackson, corporate vice president of R&D at Cadence. “The new Allegro X AI technology extends Cadence’s technology leadership in PCB design and provides a transformative impact, offering customers greater productivity through AI-powered automation, improved engine performance and integration with Cadence’s system design and analysis product portfolio.”
The new Allegro X AI technology supports Cadence’s Intelligent System Design strategy, which enables customers to accelerate system innovation. Customers can learn more at www.cadence.com/go/AllegroXAI.
Testimonial
"The I-Connect007 team is outstanding—kind, responsive, and a true marketing partner. Their design team created fresh, eye-catching ads, and their editorial support polished our content to let our brand shine. Thank you all! "
Sweeney Ng - CEE PCBSuggested Items
TI DLP® Technology Delivers High-Precision Digital Lithography for Advanced Packaging
10/02/2025 | Texas InstrumentsTexas Instruments is enhancing the next generation of digital lithography with the introduction of the DLP991UUV digital micromirror device (DMD), the company’s highest resolution direct imaging solution to date.
Rigetti, in Collaboration with QphoX, Awarded $5.8M AFRL Contract to Advance Superconducting Quantum Networking
09/29/2025 | RigettiRigetti Computing, Inc., a pioneer in hybrid quantum-classical computing, announced that it was awarded a three-year, $5.8 million contract from the Air Force Research Laboratory (AFRL) to advance superconducting quantum networking.
High-Tech Hill Technology Park Opens: Four New Factories Launched
09/26/2025 | TeltonikaThe ambitious vision announced in late 2020 to build a world-class technology park in Liepkalnis, Vilnius, has become a reality. AGP Investments, led by entrepreneur Arvydas Paukštys, together with high-tech leaders Teltonika and TLT, today inaugurated four new factories at the Vilnius High-Tech Hill Technology Park.
LPKF to Unveil CuttingMaster 2240 Cx at Productronica
09/26/2025 | LPKF Laser & ElectronicsLPKF Laser & Electronics SE will be showcasing the CuttingMaster 2240 Cx as part of the Fraunhofer IZM production line at this year's Productronica in Munich, demonstrating state-of-the-art laser technology in action.
Signal Integrity: A Game of Margins
09/25/2025 | Andy Shaughnessy, Design007 MagazineAs the founder of Wild River Technology, Al Neves deals with some of the most challenging aspects of signal integrity. Wild River’s engineers consult with high-tech companies that work at very high speeds and frequencies, often above 100G. Al is always a fun interview, so we asked him to share his thoughts on the current state of signal integrity engineering.