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Zero Touch Data Package: The Future of Seamless PCB Manufacturing

05/22/2025 | Dana Korf, Victory Giant Technology
Imagine a day when a design data file—not a traditional documentation package—is output directly from the eCAD system, transmitted to selected fabricators, and automatically loaded into their engineering/CAM systems, initiating tooling and production without any human intervention. This is zero touch data transfer in action. By eliminating manual processes, front-end personnel at fabrication facilities can be redeployed to strategic areas such as R&D and customer engagement.

Happy’s Tech Talk #38: Novel Metallization for UHDI

05/07/2025 | Happy Holden -- Column: Happy’s Tech Talk
I have been involved in high-density electronics substrates since 1970 when I joined Hewlett-Packard’s RF semiconductor group after college. Figure 1 shows the difference between trace/space lithography for substrates and silicon starting in 1970. My projects involved sapphire circuits for RF devices, but the figure displays the state of PCBs and integrated CMOS circuits and their packaging, not discreet RF devices. Even then, semiconductors were 50X higher density.

Trust in the Process: Zollner Elektronik Heavily Investing in a Future Filled With Electronics

04/30/2025 | Michelle Te, IPC Community
Family goals and values—born by one man tinkering around in his garage in Bavaria near the Czech border—are the cornerstones of IPC member Zollner Elektronik AG, one of the 15 largest EMS companies in the world, and the largest in Germany. The company places heavy priority on its employees, products, and partnerships.

NCAB Acquires 100% of B&B Leiterplattenservice GmbH in Germany

04/23/2025 | NCAB
NCAB has signed an agreement to acquire 100 percent of B&B Leiterplattenservice GmbH (B&B) headquartered in Mittweida, west of Dresden. The company had net sales of around 150 MSEK in 2024 within the PCB trading with an EBITA exceeding SEK 20 million.

PCB007 Magazine: The Essential Guide to Surface Finishes—March 2025

03/17/2025 | I-Connect007 Editorial Team
In the March 2025 issue of PCB007 Magazine, we go back to basics, recount a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. 
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