Learning with Leo: Drones—Meeting Demand Without Compromise
Nolan’s Notes: Our Spotlight on North America
Global Sourcing Spotlight: Building a Supply Chain That Bends, Not Breaks
Inspection Technologies from Viscom at NEPCON Vietnam
August 31, 2023 | Viscom AGEstimated reading time: 2 minutes
A well-prepared team from Viscom Asia is ready to welcome visitors to NEPCON Vietnam 2023 in Hanoi. Two machines will represent the wide range of inspection systems developed and manufactured at Viscom AG in Germany: iX7059 PCB Inspection XL (3D AXI) and S3088 ultra chrome (3D AOI). In combination, they cover 100% of today's post-reflow inspection requirements.
Whether research and development or production of high-end electronic devices, Vietnam is increasingly becoming a very important key player among Asian countries. This will also be evident at the International Centre of Exhibition (I.C.E.) in the country's capital from September 6 to 8. Viscom will be present at NEPCON Vietnam 2023 with its own booth No. V04. Under the vAI brand, for example, Viscom offers a growing portfolio of smart solutions in the field of artificial intelligence. NEPCON visitors will learn more about the advantages of AI in the verification process or, e.g., inspection program generation.
The exhibited iX7059 PCB Inspection XL inline X-ray system has already won the EM Innovation Award in the "X-ray inspection" category this year. Its special features include a revolutionary, fully dynamic 3D image acquisition concept with a new generation of flat panel detectors and the ability to inspect very long PCBs in lengths of up to 1600 mm (63"). High-quality 3D AXI volume calculations and slice images of the inspection areas enable, for example, the repeatably exact measurement of voids – based on high-performance planar CT.
The S3088 ultra chrome at the Viscom booth is a well-known 3D AOI system used in high-throughput production lines worldwide. For verification, it delivers true-to-life 360° renderings and color images from nine perspectives. Its advanced 3D camera technology is combined with extremely high inspection speed and outstanding inspection quality. All this is delivered as a standardized system configuration. The Viscom team is also available to answer questions about other inspection solutions, e.g., for solder paste, wire bonds, conformal coatings, or batteries.
Share on:
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.