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This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
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Challenges in Modern PCB Design and Analysis
September 5, 2023 | Steve Watt, ZukenEstimated reading time: 1 minute
Navigating the complex landscape of modern PCB design presents numerous challenges for designers and the processes they use. Concerns about time to market, performance, system-level design, requirements, costs, and staffing are driving forces that shape the evolution of the modern PCB industry.
Zuken recognizes the need to address innovation in all areas of the design process while remaining responsive to customer-driven requirements. While we can make predictions about various challenges, concerns, and requirements, our customers play a vital role in shaping the company’s development direction. They have the benefit of being “in the trenches,” so to speak, on a daily basis, so they are the subject matter experts and can help identify gaps in our tools based on where their processes are heading.
System-level Analysis
The new era of electronic systems is characterized by increasing complexity. The demand for higher data rates, lower power consumption, and smaller form factors drive this surge in complexity. As a result, the challenges of managing signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI) are also increasing.
To tackle these challenges, performing system-level SI, PI, and EMI analysis is imperative. This means the entire system must be considered, including different boards, cables, and other components. This comprehensive approach allows engineers to identify and address SI and PI problems before they lead to potential system failures. Engineers can proactively mitigate SI, PI, and EMI problems by delving into system-level analysis, which ensures robust system performance.
To read this entire article, which appeared in the August 2023 issue of Design007 Magazine, click here.
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Effects of Advanced Packaging and Stackup Design
12/26/2024 | I-Connect007 Editorial TeamKris Moyer teaches several PCB design classes for IPC and Sacramento State, including advanced PCB design. His advanced design classes take on some really interesting topics, including the impact of a designer’s choice of advanced packaging upon the design of the layer stackup. Kris shares his thoughts on the relationship between packaging and stackup, what PCB designers need to know, and why he believes, “The rules we used to live by are no longer valid.”
Beyond Design: AI-driven Inverse Stackup Optimization
12/26/2024 | Barry Olney -- Column: Beyond DesignArtificial intelligence (AI) is transforming how we conceptualize and design everything from satellites to PCBs. Traditionally, stackup planning is a manual process that can be multifaceted and relies heavily on the designer's expertise. Despite having best practices and various field solvers to optimize parameters, stackup planning remains challenging for complex designs with advanced packaging, several layers, multiple power pours, and controlled impedance requirements.