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CEE PCB to Exhibit at Electronica 2024

10/31/2024 | CEE PCB
Tom Yang, CEO of CEE PCB, has announced that his company will be exhibiting at this year’s electronica 2024 to be held in Munich, Germany from November 12th through the 15th at the Trade Faire Center Messe München.

DIS: Leaping Into Tech and Automation

10/28/2024 | Marcy LaRont, PCB007 Magazine
DIS recently opened a new facility in New York state, providing an abundance of opportunity for DIS and its customers. Jesse Ziomek, president of global business development at DIS, discusses the strides made in tech innovation and automation, expanding DIS’s customer portfolio to address the challenges its customers have been grappling with, and entering new markets such as rigid-flex and flexible PCBs.

The Cost-Benefit Analysis of Direct Metallization

10/21/2024 | Carmichael Gugliotti, MacDermid Alpha
Carmichael Gugliotti of MacDermid Alpha discusses the innovative realm of direct metallization technology, its numerous applications, and significant advantages over traditional processes. Carmichael offers an in-depth look at how direct metallization, through developments such as Blackhole and Shadow, is revolutionizing PCB manufacturing by enhancing efficiency, sustainability, and cost-effectiveness. From its origins in the 1980s to its application in cutting-edge, high-density interconnects and its pivotal role in sustainability, this discussion sheds light on how direct metallization shapes the future of PCB manufacturing across various industries, including automotive, consumer electronics, and beyond.

Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4

06/05/2024 | Happy Holden -- Column: Happy’s Tech Talk
A special case of rigid board applications is when you would like to bend the board but don’t need it to flex. We have called this case “bend-to-install” or sometimes “semi-flex.” Many electronics applications are in this class of assembly, as illustrated: Rigid board needing height adjustments, automotive lighting, industrial cameras, engine control units, and and-held portable units.

DuPont Unveils Pyralux ML Laminate Series, Offering High Thermal Management for Extreme Environments

04/09/2024 | DuPont
DuPont introduced the DuPont™ Pyralux® ML Series of double-sided metal-clad laminates, a unique addition to its extensive family of Pyralux® laminates for flexible and rigid-flex printed circuit boards (PCBs).
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