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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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HDPUG: 30 Years of Collaboration
January 1, 2024 | Madan Jagernauth, Marketing Directory HDPEstimated reading time: 1 minute
The High Density Packaging User Group International Inc. (HDP) and IPC have partnered successfully for many years. The groups signed an MoU in 2020 to strengthen this relationship, increase technical collaboration between the groups, and provide a mutual path toward emerging and disruptive high-density interconnect (HDI) technologies.
What is HDP?
HDP, founded in 1993, is a nonprofit trade organization that offers memberships to companies involved in the electronics manufacturing industry. HDP's mission is to drive innovations in the electronics industry, reducing cost and time to market through active collaborations that solve critical and emerging problems. HDP is focused on the characterization and reliability of electronic assemblies and sub-assemblies, focusing on new technologies.
This article originally appeared in the fall 2023 issue of IPC Community. To learn more about HDP’s area of focus and process, click here.
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Rachael Temple - AlltematedSuggested Items
Robot Density Surges in Europe, Asia, and Americas
04/08/2026 | International Federation of RoboticsEconomies worldwide are prioritising the integration of factory robots, as automation becomes a critical tool for boosting productivity. In the global automation race, the Western European countries reached a record 267 robots per 10,000 employees in the manufacturing industry 2024 – ahead of North America with 204 units and Asia with 131 units.
onsemi Powers Sineng Electric’s Advanced Solar and Energy Storage Solutions
04/08/2026 | onsemionsemi announced that its hybrid power integrated modules (PIMs) will be featured in Sineng Electric’s next-generation 430 kW liquid-cooled string energy storage systems (ESS) and 320 kW utility-scale solar inverter.
Infineon, DG Matrix Advance AI Data Center Power with SiC Technology
03/24/2026 | InfineonInfineon Technologies AG and DG Matrix, a global leader in Solid-State Transformer (SST) solutions, are partnering to enhance the efficiency of power conversion required to connect AI data centers and industrial power applications to the public grid.
Henger to Showcase AI‑Era Plasma Solutions at APEX EXPO 2026
03/11/2026 | HengerHenger will be exhibiting at APEX EXPO 2026 to present its latest plasma treatment solutions designed for the AI‑driven generation of high‑speed, high‑density PCB manufacturing.
UHDI Fundamentals—Foundations and Drivers of the PCB Flex: Advanced Packaging Nexus, Part 1
03/02/2026 | Anaya Vardya, American Standard CircuitsThe electronics industry is undergoing a fundamental transformation driven by demands for smaller form factors, higher performance, and greater functional integration. Two technologies sit at the center of this transformation: flexible PCBs and advanced semiconductor packaging. In this article, I’ll explore the technical foundations and key forces driving this convergence. Flexible PCBs are electrical interconnects fabricated on bendable substrates such as polyimide or polyester. Unlike rigid PCBs, flex circuits can conform to three-dimensional shapes, enabling designers to route signals through space rather than across flat planes.