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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Advancing PCB Technology: A Conversation With John Johnson
June 4, 2024 | Barry Matties, Publisher, I-Connect007Estimated reading time: 1 minute
John Johnson, an industry veteran with 45 years of experience, shares insights on the adoption of the Averatek process at American Standard Circuits, highlights the shift toward finer lines and spaces in PCB manufacturing, and emphasizes the importance of technology, cleanliness, and material adhesion in achieving ultra-fine lines. He addresses the challenges in advancements of the additive process, emphasizing the need for a mindset shift and employee training. His outlook on the future of PCB technology in North America underscores the growing demand for innovative solutions and the importance of domestic production.
This interview originally appeared in the May 2024 issue of PCB007 Magazine.
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Rachael Temple - AlltematedSuggested Items
Industry-Wide Memory Constraints Grow as AI-Driven Supply Shift Reshapes Market
04/13/2026 | Global Electronics AssociationArtificial Intelligence is consuming a growing share of the world’s memory supply, leaving electronics manufacturers across industries facing longer lead times, rising prices, and increasing uncertainty, according to a new report released today from the Global Electronics Association.
ASTER and Siemens: Design for Test Gets ‘Real’
04/02/2026 | Nolan Johnson, I-Connect007For more than 30 years, ASTER Technologies has been a leader in PCB assembly test verification and engineering software. Siemens Digital Industries Software and ASTER Technologies’ recent merger represents the third strategic acquisition by Siemens in the space between design and manufacture. We spoke with ASTER Technical Director Will Webb, Michael Alam, head of corporate development for Siemens’ Electronic Board Systems Group, and Patrick Hope, Valor marketing specialist at Siemens, about the strategy and vision that’s bringing all these post-layout tools into the design workflow.
Elementary Mr. Watson: Where the PCB Ends and Advanced Packaging Begins
01/29/2026 | John Watson -- Column: Elementary, Mr. WatsonChange sits at the center of almost everything in PCB design. From the earliest days of printed circuits to today’s highly integrated electronic systems, stability does not define this discipline; evolution does. Materials change, component geometries shrink, signal speeds increase, and manufacturing processes advance. With each shift, we reshape the role of the PCB designer, sometimes quietly, and other times in a way that feels like a freight train driving through your living room.
The Power of Onshoring High-tech Thermal Control
12/02/2025 | Brian Buyea, RemtecIn advanced electronics, thermal management has become the silent determinant of performance. As devices shrink and power densities soar, how we handle heat defines not only the reliability of a system but also the pace of innovation itself. High-tech thermal control is no longer a supporting role, but a core enabler of modern technology, encompassing power modules and RF devices, as well as electric vehicles and medical systems.
Real Time with... SMTAI 2025: Innovations in Solder Materials— Kevin Brennan's Journey at Indium
11/05/2025 | Real Time with...SMTAIIn this interview from SMTAI 2025, Kevin Brennan shares his five-year journey at Indium Corporation, where he has worked in R&D, process engineering, and product management. Indium focuses on engineered solder materials, introducing new products like halogen-free and high-temperature alloys to meet industry challenges. The discussion covers a shift to low-temperature alloys to reduce warpage in larger chips and highlights the Indium 12.9 HF flux for high-density boards. Kevin reflects on the supportive community at Indium.