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INEMI Publishes Roadmaps for Board Assembly and Complex Integrated Systems and Expands PCB Roadmap to Include Laminates

06/18/2025 | iNEMI
The International Electronics Manufacturing Initiative (INEMI) has published content on three new roadmap topics in key areas of electronics systems: board assembly, complex integrated systems and laminates.

Day 2: More Cutting-edge Insights at the EIPC Summer Conference

06/18/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) summer conference took place this year in Edinburgh, Scotland, June 3-4. This is the third of three articles on the conference. The other two cover Day 1’s sessions and the opening keynote speech. Below is a recap of the second day’s sessions.

STI Celebrates Travis Wease’s 10 Years of Dedicated Service

06/17/2025 | STI Electronics, Inc.
STI Electronics, Inc., a full-service organization providing training services, training materials, analytical/failure analysis, prototyping, and contract electronic manufacturing, proudly celebrated the 10-year work anniversary of Travis Wease, Master Instructor and valued team member.

Turning Uncertainty into Opportunity: VEXOS Opens Second Vietnam Office

06/17/2025 | EINPresswire.com
Vexos announced the opening of its second office in Vietnam, located in Hanoi as part of its ongoing commitment to expand its Custom Material Solutions (CMS) business, and enhance global sourcing capabilities. Following the establishment of its Ho Chi Minh City facility in 2018, the new Hanoi office marks a significant step in strengthening the presence of VEXOS in Southeast Asia.

Day 1: Cutting Edge Insights at the EIPC Summer Conference

06/17/2025 | Pete Starkey, I-Connect007
The European Institute for the PCB Community (EIPC) Summer Conference took place this year in Edinburgh, Scotland, June 3-4. This is the second of three articles on the conference. The other two cover the keynote speeches and Day 2 of the technical conference. Below is a recap of the first day’s sessions.
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