-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueCreating the Ideal Data Package
Why is it so difficult to create the ideal data package? Many of these simple errors can be alleviated by paying attention to detail—and knowing what issues to look out for. So, this month, our experts weigh in on the best practices for creating the ideal design data package for your design.
Designing Through the Noise
Our experts discuss the constantly evolving world of RF design, including the many tradeoffs, material considerations, and design tips and techniques that designers and design engineers need to know to succeed in this high-frequency realm.
Learning to Speak ‘Fab’
Our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. As you will see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 7, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It’s been a great week. I spent part of the week at PCB East, which was held at the Boxboro Regency in Boxboro, Massachusetts. I haven’t been to Boxboro in about 20 years. The last time I was at PCB East in Boxboro, design instructor Mary Sugden had a hot plate and a supply of bologna in her room, because she preferred fried bologna to anything she could get in a restaurant. Never a dull moment with PCB designers!
PCB East has been growing since it re-opened a few years ago. The conference was well attended, and Wednesday’s expo was busy all day long. These one-day tabletop shows are the way to go, as we’ve seen lately with the success of SMTA’s local shows. I’ll have a post-show write-up next week.
But I’m glad to be home. Here’s a roundup of this week’s top news as you head into the weekend.
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Published December 8
Technology Editor Happy Holden has been following the growing development of “bend-to-install” or “semi-flex” materials. In this update, Happy breaks down the details of this process, which, unlike flexible circuits, utilizes standard FR-4 materials and processes. We’re seeing a lot of “hybrid” processes like this now, and we’ll continue to follow this technology.
My Experience as an International Student
Published June 5
It must be really stressful being an international student; I had a hard enough time graduating from college in the country where I was born. But Palash Vyas is a little more of a go-getter than I was, to say the least. In this article, the recent doctoral graduate outlines his path from Mumbai to Auburn University, his volunteer efforts with IPC and SMTA, and winner of Best Poster Award at this year’s IPC APEX EXPO.
The Pulse: Overconstraining: Short, Slim, and Smooth
Published June 6
As columnist Martyn Gaudion says, small is beautiful in high-speed design and high reliability. To avoid overconstraining your high-speed board, Martyn explains why keeping things “short, slim, and smooth” are watchwords and why designers must take cost and DFM into account with each design.
Has It Really Been Survival Mode?
Published June 6
This is a topic that we’ve been hearing about for years: Companies in the EMS industry that are doing well have done so by being in “survival mode” for years. But is that really the case? Mark Wolfe examines this issue, starting with the four questions that each EMS manager answers before accepting every job.
Advancing PCB Technology: A Conversation With John Johnson
Published June 4
In this audio interview, John Johnson of American Standard Circuit discusses the industry’s continued movement toward finer lines and spaces and additive processes, as well as the need for a “mindset shift” and training in order to meet the needs of this new technology. He also discusses the need to focus on cleanliness and material adhesion with ultra-fine lines.
Suggested Items
Nordson Reports Q2 Fiscal 2025 Results and Q3 Guidance
05/30/2025 | BUSINESS WIRENordson Corporation reported results for the fiscal second quarter ended April 30, 2025. Sales were $683 million compared to the prior year’s second quarter sales of $651 million.
CE3S Launches EcoClaim Solutions to Simplify Recycling and Promote Sustainable Manufacturing
05/29/2025 | CE3SCumberland Electronics Strategic Supply Solutions (CE3S), your strategic sourcing, professional solutions and distribution partner, is proud to announce the official launch of EcoClaim™ Solutions, a comprehensive recycling program designed to make responsible disposal of materials easier, more efficient, and more accessible for manufacturers.
IDC Introduces the Enterprise PC Trust Perception Index
05/21/2025 | IDCThe Enterprise PC Trust Index, International Data Corporation’s (IDC) first independent study of PC vendors in the trust space, was issued.
Eltek Reports 2025 Q1 Financial Results; Revenue Up 8%
05/20/2025 | PRNewswireEltek Ltd., a global manufacturer and supplier of technologically advanced solutions in the field of printed circuit boards (PCBs), announced its financial results for the quarter ended March 31, 2025.
Mycronic High Flex Changes Division Name to PCB Assembly Solutions
05/20/2025 | MycronicMycronic AB, the leading Sweden-based electronics assembly solutions provider, announced that its division formerly known as High Flex will now operate under the name PCB Assembly Solutions.