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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
June 7, 2024 | Andy Shaughnessy, Design007 MagazineEstimated reading time: 2 minutes

It’s been a great week. I spent part of the week at PCB East, which was held at the Boxboro Regency in Boxboro, Massachusetts. I haven’t been to Boxboro in about 20 years. The last time I was at PCB East in Boxboro, design instructor Mary Sugden had a hot plate and a supply of bologna in her room, because she preferred fried bologna to anything she could get in a restaurant. Never a dull moment with PCB designers!
PCB East has been growing since it re-opened a few years ago. The conference was well attended, and Wednesday’s expo was busy all day long. These one-day tabletop shows are the way to go, as we’ve seen lately with the success of SMTA’s local shows. I’ll have a post-show write-up next week.
But I’m glad to be home. Here’s a roundup of this week’s top news as you head into the weekend.
Happy’s Tech Talk #29: Bend-to-Install Semi-flex FR-4
Published December 8
Technology Editor Happy Holden has been following the growing development of “bend-to-install” or “semi-flex” materials. In this update, Happy breaks down the details of this process, which, unlike flexible circuits, utilizes standard FR-4 materials and processes. We’re seeing a lot of “hybrid” processes like this now, and we’ll continue to follow this technology.
My Experience as an International Student
Published June 5
It must be really stressful being an international student; I had a hard enough time graduating from college in the country where I was born. But Palash Vyas is a little more of a go-getter than I was, to say the least. In this article, the recent doctoral graduate outlines his path from Mumbai to Auburn University, his volunteer efforts with IPC and SMTA, and winner of Best Poster Award at this year’s IPC APEX EXPO.
The Pulse: Overconstraining: Short, Slim, and Smooth
Published June 6
As columnist Martyn Gaudion says, small is beautiful in high-speed design and high reliability. To avoid overconstraining your high-speed board, Martyn explains why keeping things “short, slim, and smooth” are watchwords and why designers must take cost and DFM into account with each design.
Has It Really Been Survival Mode?
Published June 6
This is a topic that we’ve been hearing about for years: Companies in the EMS industry that are doing well have done so by being in “survival mode” for years. But is that really the case? Mark Wolfe examines this issue, starting with the four questions that each EMS manager answers before accepting every job.
Advancing PCB Technology: A Conversation With John Johnson
Published June 4
In this audio interview, John Johnson of American Standard Circuit discusses the industry’s continued movement toward finer lines and spaces and additive processes, as well as the need for a “mindset shift” and training in order to meet the needs of this new technology. He also discusses the need to focus on cleanliness and material adhesion with ultra-fine lines.
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07/04/2025 | Nolan Johnson, I-Connect007Today marks the 248th anniversary of the signing of the American Declaration of Independence by the Continental Congress. Known widely in the U.S. as Independence Day or “The Fourth of July,” this day also commemorates the declaration by the Congress that the American colonies are free and independent states.
MRSI Systems, LLC Files Patent Infringement Lawsuit Against Suzhou LieQi in China
06/16/2025 | MRSI Systems, LLCMRSI Systems, LLC (a part of Mycronic Group), a global high-tech company that provides high precision production solution in electronics industry, filed a patent infringement lawsuit against Suzhou LieQi Intelligent Equipment Co., Ltd. (SZLQ) with Shenzhen Intermediate People’s Court for infringement of MRSI Systems’ patent related to die bonder (Case No. (2025) YUE03minchu No. 7154).
Project GENESIS Minimizes Ecological Footprint in Europe’s Semiconductor Industry
06/06/2025 | Fraunhofer IPMSA pan-European consortium dedicated to developing sustainable processes and technologies for the semiconductor-manufacturing supply chain announces the launch of the GENESIS project.
Zhen Ding Promotes Digital Transformation and Embraces AI Business Opportunities
06/06/2025 | Zhen Ding TechnologyOn May 27, 2025, General Manager Chen-Fu Chien of Zhen Ding Technology Group was invited to attend the "2025 Two Thousand Forum" held by The CommonWealth Magazine.
IMI Signs Share Purchase Agreement to Sell Its Czech Republic Manufacturing Site
06/06/2025 | IMIIntegrated Micro-Electronics Inc (IMI), through its wholly-owned subsidiary, Coöperatief IMI Europe U.A., has signed a share purchase agreement to sell 100% of the shares in IMI Czech Republic (IMI CZ) to KEBODA Deutschland GmbH & Co. KG, a subsidiary of Keboda Technology Co., Ltd. (Keboda), a publicly listed company in China.