-
- News
- Books
Featured Books
- pcb007 Magazine
Latest Issues
Current IssueVoices of the Industry
We take the pulse of the PCB industry by sharing insights from leading fabricators and suppliers in this month's issue. We've gathered their thoughts on the new U.S. administration, spending, the war in Ukraine, and their most pressing needs. It’s an eye-opening and enlightening look behind the curtain.
The Essential Guide to Surface Finishes
We go back to basics this month with a recount of a little history, and look forward to addressing the many challenges that high density, high frequency, adhesion, SI, and corrosion concerns for harsh environments bring to the fore. We compare and contrast surface finishes by type and application, take a hard look at the many iterations of gold plating, and address palladium as a surface finish.
It's Show Time!
In this month’s issue of PCB007 Magazine we reimagine the possibilities featuring stories all about IPC APEX EXPO 2025—covering what to look forward to, and what you don’t want to miss.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - pcb007 Magazine
Audits: A Critical Element of Process Control
September 3, 2024 | Randy Cherry, IPCEstimated reading time: 1 minute

A formal audit always seems difficult to justify. Companies do not want the expense, and employees do not want the hassle. There is always a chance of failure, and management struggles to understand the benefits. If you or your company has had issues with auditing, hopefully, this article will help you feel a little more comfortable about the auditing process.
First, let’s discuss the internal process audit, which can help you avoid or eliminate many costly manufacturing problems, reduce scrap, increase yields, and directly improve your bottom line.
Process auditing can be simple and easy to maintain if you create a repeatable, impartial auditing process. Start with a Process Verification or Surveillance process audit. Create a basic yes/no checklist that covers each key manufacturing process within your facility. Another idea is to design a checklist covering all manufacturing processes from receiving to shipping and everything in between.
The Process Verification or Surveillance process audit is designed to be high-level. Unlike with a formal audit, objective evidence is not required. You are simply looking for gaps in the manufacturing process against your own internal procedures, standards, and work instructions. If your company operates by industry standards, add those to your checklist. It is best practice to perform Process Verification or Surveillance process audits once per quarter. As you collect and analyze data from the checklist, you can determine the most beneficial internal audit frequency moving forward. Let data drive the decision on audit frequency. Do not base it on opinions.
Going All the Way
Once you have determined your internal manufacturing processes and have met your goals for the Process Verification or Surveillance process audits, you may opt for the next step, which is to have a third-party auditor from an outside company perform a full manufacturing process audit to industry standards and your internal procedures and work instructions. The focus must be on the manufacturing processes, not your quality standards. Most companies have ISO certifications already in place that cover most quality concerns.
To read the entire article, which was originally published in the August 2024 issue of PCB007 Magazine, click here.
Suggested Items
NXP Unveils Third-Generation Imaging Radar Processors for Level 2+ to 4 Autonomous Driving
05/09/2025 | NXP SemiconductorNXP Semiconductors N.V. unveiled its new S32R47 imaging radar processors in 16 nm FinFET technology, building on NXP’s proven expertise in the imaging radar space.
Scanfil Boosts Investment in Electronics Manufacturing in the US
05/08/2025 | BUSINESS WIREScanfil is investing in a second electronics manufacturing line in Atlanta, Georgia, USA. The demand for manufacturing electronics in the USA has increased over the past two years and is expected to continue growing.
ZESTRON Announces New Reliability and Solutions Service for Risk Assessment & Mitigation of Electronic Assemblies
05/06/2025 | ZESTRONZESTRON, the leading global provider of high-precision cleaning products, services, and training solutions, is thrilled to introduce its new Reliability and Solutions (R&S) service.
Trouble in Your Tank: Causes of Plating Voids, Pre-electroless Copper
05/09/2025 | Michael Carano -- Column: Trouble in Your TankIn the business of printed circuit fabrication, yield-reducing and costly defects can easily catch even the most seasoned engineers and production personnel off guard. In this month’s column, I’ll investigate copper plating voids with their genesis in the pre-plating process steps.
Knocking Down the Bone Pile: Gold Mitigation for Class 2 Electronics
05/07/2025 | Nash Bell -- Column: Knocking Down the Bone PileIn electronic assemblies, the integrity of connections between components is paramount for ensuring reliability and performance. Gold embrittlement and dissolution are two critical phenomena that can compromise this integrity. Gold embrittlement occurs when gold diffuses into solder joints or alloys, resulting in mechanical brittleness and an increased susceptibility to cracking. Conversely, gold dissolution involves the melting away of gold into solder or metal matrices, potentially altering the electrical and mechanical properties of the joint.