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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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IPC: PCB Designers Invited to Attend PEDC-Pan-European Electronics Design Conference
December 30, 2024 | IPCEstimated reading time: Less than a minute
The Pan-European Electronics Design Conference (PEDC), co-hosted by FED and IPC, will take place on January 29-30, 2025. This two-day conference, held in English, will bring together global PCB designers for a comprehensive exchange of ideas and insights on the latest trends and technologies in electronics design.
Key Highlights:
- Two Keynotes: Explore the impact of AI and the "Silicon-to-Systems" approach on the future of electronics design.
- 24 Presentations: Hear from renowned experts on the latest advancements in electronics design, including development, design for excellence, software and tools, and the design process of electronic systems.
- Two Expert Panels: Engage in insightful discussions on AI in electronics and the product life cycle.
- Networking Reception: Connect with industry leaders, researchers, and fellow designers.
- PEDC offers a unique opportunity for PCB designers to gain cutting-edge knowledge, expand their professional network, and explore the future of electronics design.
For more information, visit pedc.eu.
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The Future of Reflow Soldering Is Here
04/16/2026 | Real Time with... APEX EXPOMichael Hanke discusses how Rehm Thermal Systems is revolutionizing thermal solutions in electronics assembly with their innovative flux-free, no-clean soldering process. This is truly a game changing process that eliminates chamber cleaning and streamlines production. Developed with paste suppliers, this advanced technology promises significant time and cost savings while ensuring high-quality results.
The Global Electronics Association Is Future Forward
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MEIKO Electronics Expands ASEAN Footprint with New Vietnam Subsidiary to Support Growing Demand
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From AI to AEP, an Impressive Array of Keynotes at APEX EXPO 2026
04/17/2026 | Marcy LaRont and Nolan Johnson, I-Connect007Each year at APEX EXPO, the Global Electronics Association provides an impressive lineup of keynote speakers to kick off the largest electronics manufacturing event in North America. This year included four keynote speeches, on topics ranging from the promise and peril of AI to the power of electronics, quantum computing, and the importance of heterogeneous integration in advanced electronics packaging.