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UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
February 6, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute

Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming:
Virtual reality (VR) and Augmented Reality (AR) in Gaming Systems
VR and AR experiences demand high performance in compact devices. UHDI supports:
- Miniaturized optics and display controllers: Facilitating lightweight, ergonomic headsets.
- High-speed processing for low latency: Essential for seamless motion tracking and real-time rendering.
- Integrated sensors and cameras: Enabling depth perception, spatial tracking, and hand gestures.
- Wireless modules for untethered use: Compact UHDI-based circuits enable high-speed, low-latency communication.
Gaming consoles and PCs are leveraging UHDI to deliver cutting-edge performance:
- Integrated GPUs and CPUs: High-density circuits for real-time ray tracing and AI-driven graphics.
- Compact cooling systems: UHDI designs support high-performance hardware in slimmer devices.
- High-speed interfaces: Supports ultra-fast storage and data transfer for seamless gameplay.
- Portable gaming devices: Miniaturized UHDI designs make powerful handheld systems possible.
To continue reading this article, which originally appeared in the January 2025 issue of Design007 Magazine, click here.
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Episode 6 of Ultra HDI Podcast Series Explores Copper-filled Microvias in Advanced PCB Design and Fabrication
10/15/2025 | I-Connect007I-Connect007 has released Episode 6 of its acclaimed On the Line with... American Standard Circuits: Ultra High Density Interconnect (UHDI) podcast series. In this episode, “Copper Filling of Vias,” host Nolan Johnson once again welcomes John Johnson, Director of Quality and Advanced Technology at American Standard Circuits, for a deep dive into the pros and cons of copper plating microvias—from both the fabricator’s and designer’s perspectives.
Interposers, Substrates, and Advanced Manufacturing
10/13/2025 | Marcy LaRont, I-Connect007I attend a lot of industry trade shows and conferences. Lately, during conversations with technologists, I’ve noticed that there is some confusion about what exactly constitutes an interposer. One question I hear every so often is, “Are all interposers substrates?” The short answer to that question is no. But some interposers are, in fact, full substrates.
I-Connect007 Releases Episode 5 of Groundbreaking Ultra HDI Podcast Series
10/10/2025 | I-Connect007In Episode 5 “Via Structures,” host Nolan Johnson welcomes back John Johnson, Director of Quality and Advanced Technology at American Standard Circuits. Together, they explore the designer’s perspective on UHDI’s impact on via structures, diving into the metallurgy, chemistry, mechanical considerations, and stackup reduction that provide greater design flexibility and fewer constraints than ever before.
New Podcast Episode: How Does UHDI Benefit SWaP?
10/03/2025 | I-Connect007In podcast episode 4, “SWaP Considerations,” host Nolan Johnson welcomes back industry expert John Johnson, Director of Quality and Advanced Technology at American Standard Circuits (ASC). Together, they explore how UHDI delivers measurable advantages in size, weight, and power (SWaP)—unlocking new possibilities in speed, efficiency, and miniaturization.
Connect the Dots: Evolution of PCB Manufacturing—Lamination
10/02/2025 | Matt Stevenson -- Column: Connect the DotsWhen I wrote The Printed Circuit Designer's Guide to...™ Designing for Reality, it was not a one-and-done effort. Technology is advancing rapidly. Designing for the reality of PCB manufacturing will continue to evolve. That’s why I encourage designers to stay on top of the tools and processes used during production, to ensure their designs capitalize on the capabilities of their manufacturing partner.