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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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UHDI Fundamentals: UHDI Bleeding-edge Entertainment Applications, Part 2
February 6, 2025 | Anaya Vardya, American Standard CircuitsEstimated reading time: Less than a minute
Ultra high density interconnect (UHDI) technology is revolutionizing bleeding-edge entertainment applications by enabling compact, high-performance devices that push the boundaries of immersion, interactivity, and realism. Part 2 focuses on how UHDI is advancing the entertainment industry, particularly gaming:
Virtual reality (VR) and Augmented Reality (AR) in Gaming Systems
VR and AR experiences demand high performance in compact devices. UHDI supports:
- Miniaturized optics and display controllers: Facilitating lightweight, ergonomic headsets.
- High-speed processing for low latency: Essential for seamless motion tracking and real-time rendering.
- Integrated sensors and cameras: Enabling depth perception, spatial tracking, and hand gestures.
- Wireless modules for untethered use: Compact UHDI-based circuits enable high-speed, low-latency communication.
Gaming consoles and PCs are leveraging UHDI to deliver cutting-edge performance:
- Integrated GPUs and CPUs: High-density circuits for real-time ray tracing and AI-driven graphics.
- Compact cooling systems: UHDI designs support high-performance hardware in slimmer devices.
- High-speed interfaces: Supports ultra-fast storage and data transfer for seamless gameplay.
- Portable gaming devices: Miniaturized UHDI designs make powerful handheld systems possible.
To continue reading this article, which originally appeared in the January 2025 issue of Design007 Magazine, click here.
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From Backbone to Breakthroughs: I-Connect007 Wraps PCB Materials Series with Focus on Innovation
04/30/2026 | I-Connect007I-Connect007 wraps up its six-part podcast series, PCB Materials: The Backbone and Future of Electronics, with Episode 6 and a discussion focusing on innovation. In Episode 6, Marcy LaRont speaks with Isola CTO Kirk Thompson about a critical turning point for the PCB industry as innovation accelerates. As data rates climb and demands from AI infrastructure, power density, flexible electronics, photonics, and chiplet integration intensify, traditional material assumptions are no longer sufficient.
ASC’s John Johnson Bullish on the U.S. and High-tech PCBs
04/28/2026 | Marcy LaRont, I-Connect007It was a good couple of days at the SMTA UHDI Symposium in Avondale, Arizona, in early April, where John Johnson, head of technology at American Standard Circuits (ASC) and resident PCB expert on UHDI in the real-world of manufacturing, was a presenter. As the symposium ended, I visited with John, who reflected on what he considered most important and what had made the greatest impression on him.
SMTA Ultra HDI Symposium, Day 2: Fragile Supply Chains, Fierce Innovation
04/14/2026 | Marcy LaRont, I-Connect007The Arizona weather yielded another beautiful day as we gathered for the second day of SMTA’s annual UHDI symposium. After the first full day discussing the role of AI in business and the how-tos of implementation, Avondale Mayor Mike Pineda kicked off day two, proud to showcase his city and to declare its important place in the continued development of the West Valley, an increasingly important area for tech and manufacturing.
SMTA Ultra HDI Symposium, Day 1: AI at the Core or Out of the Game
04/13/2026 | Marcy LaRont, I-Connect007It was a beautiful 81°F morning in Arizona last Wednesday as I headed to the third annual SMTA Ultra HDI Symposium, focused on AI and ultra high density interconnect technology. Strategically held as part of Arizona’s Tech Week, this year’s conference took place in Avondale in Phoenix's West Valley. The event moved from the cozy offices of the Peoria Sports Complex (which paid homage to baseball’s spring training world) to the larger Avondale Conference Center, highlighting the importance of this area for electronics manufacturing investment.
Sustainability Takes Center Stage in ‘On the Line With… Isola’ Podcast, Episode 3
03/25/2026 | I-Connect007I-Connect007 announces the release of Episode 3 of the podcast series On the Line With…, titled “The Green Circuit—Sustainability in PCB Manufacturing.” In this installment of PCB Materials: The Backbone and Future of Electronics, host Marcy LaRont speaks with Isola CTO Kirk Thompson about the growing role sustainability is playing in shaping the next generation of PCB materials and manufacturing processes.