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Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
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Design007 Magazine March 2025: Learning to Speak 'Fab'
March 10, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
When we started planning this issue, we couldn’t help comparing PCB designers and fabricators to citizens of different countries trying to communicate. They can each comprehend most of what the other person is saying, but a lot of the little things are lost in translation. And here again, it’s the little things that can cause big misunderstandings.
In the March 2025 issue of Design007 Magazine, our expert contributors clear up many of the miscommunication problems between PCB designers and their fab and assembly stakeholders. But as we see, a little extra planning early in the design cycle can go a long way toward maintaining open lines of communication with the fab and assembly folks.
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Mexico’s Wire Harness Pivot Point
04/22/2026 | Nolan Johnson, SMT007 MagazineMexico is a major producer of wire harnesses, but recent U.S. economic policies and Mexico’s domestic issues have had a ripple effect on the industry. Jesus Duarte, vice president of Mexico Assembly Wire Technology and president of Expo Wire Tech, explains the issue in greater depth and how the wire harness industry should respond on its own, rather than just reflect what Tier 1s are doing.
AI, Connectivity, and Systems-Level Thinking: New Frontiers in Advanced Packaging
04/16/2026 | I-Connect007 Editorial TeamThe upcoming issue of Advanced Electronics Packaging Digest examines key developments shaping the next phase of electronics innovation, from the reliability challenges of AI-driven packaging to emerging connectivity standards and the broader systems-level implications of artificial intelligence.
Nolan’s Notes: Wire Harness—The Underdog of the Industry
04/01/2026 | Nolan Johnson -- Column: Nolan's NotesMy dad’s favorite cartoon character was “Underdog,” one of the very first American Saturday morning cartoon shows. When someone asked him for help, Underdog would proudly declare, “Never Fear! Underdog is here!” Over time, I learned that “underdog” had a wider, more socially poignant meaning than just the name of a cartoon superhero. These stories about underdogs kept coming to mind while working on this issue about the challenges facing the wire harness industry. The product is not exactly glamorous and is often treated as an afterthought, but it is most certainly critical to the system.
Global Electronics Association Advocacy Update
03/24/2026 | Real Time with... APEX EXPOChris Mitchell, chief advocacy officer for the Global Electronics Association, details the association's enhanced advocacy and industry intelligence initiatives, including new hires and improved data analysis. He discusses critical global trade issues, recent tariff rulings, and the importance of strengthening North America's electronics ecosystem through USMCA collaboration.
I-Connect007 Magazine: AI, Tolerances, Flexible Circuits, and More
03/17/2026 | I-Connect007 Editorial TeamIn the spirit of March Madness, the latest issue of I-Connect007 Magazine tackles a full bracket of topics engineers face on real boards, from AI-powered design tools and cumulative tolerances to copper pours, etch factors, flexible circuits, and solder mask details.