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I-Connect007 Editor’s Choice: Five Must-Reads for the Week
May 16, 2025 | Nolan Johnson, I-Connect007Estimated reading time: 2 minutes
Well, progress is being made on resetting trade agreements. There was plenty of coverage in the mainstream news this week on the topic of trade agreements, including Monday's announcement of a trade agreement with China. I don’t see any evidence that we're done yet with the see-sawing global supply chain dynamic, and there will still be knock-on effects we haven't anticipated. But there is hope that things will get better rather than worse.
My picks for the week include—as a complement to the trade agreement news—SEMI's public support of a bill including new tax credit eligibility for semiconductor manufacturers. This provision feels quite similar to the current PCB investment bill that's been introduced to the current Congress; here’s hoping Congress takes a more holistic approach to electronics manufacturing.
I highlight a market report on OSAT manufacturers worldwide. It’s worth a read for you supply chain experts. Two of our columnists this week wrote complementary pieces on active listening and problem-solving with your customers—it's always good to keep up with the foundational skills. Finally, a piece on manufacturing investments in India. Regional build-out is clearly a global shift in thinking.
SEMI Applauds New Bill to Clarify Tax Credit Eligibility for Critical Semiconductor Suppliers Under U.S. CHIPS Act
Published May 12
This feels quite similar to the current PCB investment bill that's been introduced to the current Congress. With a lot of uncertainty about the future of the CHIPS Act under the Trump administration, I can see why legislators are eager to introduce new legislation to keep electronics manufacturing front and center.
Top 10 OSAT Companies of 2024 Revealed—China Players See Double-Digit Growth, Reshaping the Global Market Landscape
Published May 13
New developments in OSAT and advanced packaging are emerging as technology drivers for the assembly line, especially for EMS companies. This Trendforce report summarizes the conflicting forces in the OSAT space: demand growth and provider consolidation. See how the main players in the OSAT space are jockeying for position and niche in this report.
It’s Only Common Sense: Stop Pitching, Start Listening
Published May 12
Dan Beaulieu’s column tackles the fine art of active listening. For example, Dan writes, “It’s about forming genuine connections through open-ended questions that demonstrate curiosity and empathy. These questions show your customer you’re interested in helping them succeed.” You can’t hear their pain points if you’re the one doing the talking.
Fresh PCB Concepts: The Power of a Lunch & Learn for PCB Professionals
Published May 15
It’s a moment of I-Connect007 Zen when our columnists line up on complementary topics. In this case, NCAB’s Michael Marshall and Dan Beaulieu both had similar thoughts. One way to develop a thriving environment for active listening is to follow Michael Marshall’s guidelines for Lunch & Learn customer visits. Seriously, engineers have a special appreciation for a good mid-day meal and a technical discussion Learn more about Michael’s winning formula here.
Indian Government Establishes Panel for New National Manufacturing Mission
Published May 14
Creating (or revitalizing) electronics manufacturing at the regional level is a global trend, and India is investing in its own manufacturing infrastructure. According to the article, manufacturing makes up about 16–17% of India’s GDP, and the Indian government is looking to increase that share.
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EMAC Returns with Bright Electronics Manufacturing Challenge 2026
04/30/2026 | SMTAThe Electronics Manufacturing & Assembly Collaborative (EMAC) has announced the return of the Bright Electronics Manufacturing Challenge 2026, an immersive, hands-on student competition that puts real electronics manufacturing experience into the hands of the next generation of engineers.
Zhen Ding, Tsinghua University Launch Phase II R&D and Digital Transformation Program
04/30/2026 | Zhen DingZhen Ding Technology Holding Limited, a global leader in the PCB industry, held the launch ceremony for the Phase II (2026-2030) Industry-Academia Collaboration Program of the Zhen Ding-Tsinghua Joint Research Center at the Zhen Ding Technology Lecture Hall on the Tsinghua University campus.
SCHMID Launches 'Any Layer ET' for Panel-Level Advances Packaging, to Present at ECTC 2026
04/30/2026 | SCHMID GroupSCHMID Group, a global leader in advanced manufacturing solutions for the electronics and semiconductor industries, is advancing next-generation substrate manufacturing with its proprietary Any Layer ET (Embedded Trace) Process for full panel-level Advanced Packaging.
Hon Hai, Mitsubishi Electric Exploring Automotive Equipment Business in MOU
04/29/2026 | Hon Hai Precision Industry Co., Ltd.Hon Hai Precision Industry Co. Ltd. (Foxconn) and Mitsubishi Electric Corporation have signed a Memorandum of Understanding to explore a strategic alliance through joint operation of the automotive equipment business.
SEMIEXPO Heartland 2026 Highlights Automotive Electronics and Smart Manufacturing Innovation
04/29/2026 | SEMIThe second edition of SEMIEXPO Heartland opens this week, April 29-30 at the Detroit Marriot at the Renaissance Center in Detroit, Michigan, centered around smart manufacturing, automotive electronics, and workforce development.