-
-
News
News Highlights
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueSignal Integrity
If you don’t have signal integrity problems now, you will eventually. This month, our expert contributors share a variety of SI techniques that can help designers avoid ground bounce, crosstalk, parasitic issues, and much more.
Proper Floor Planning
Floor planning decisions can make or break performance, manufacturability, and timelines. This month’s contributors weigh in with their best practices for proper floor planning and specific strategies to get it right.
Showing Some Constraint
A strong design constraint strategy carefully balances a wide range of electrical and manufacturing trade-offs. This month, we explore the key requirements, common challenges, and best practices behind building an effective constraint strategy.
- Articles
- Columns
- Links
- Media kit
||| MENU - design007 Magazine
How Good Design Enables Sustainable PCBs
August 21, 2025 | Gerry Partida, Summit InterconnectEstimated reading time: 1 minute

Sustainability has become a key focus for PCB companies seeking to reduce waste, conserve energy, and optimize resources. While many discussions on sustainability center around materials or energy-efficient processes, PCB design is an often overlooked factor that lies at the heart of manufacturing.
Good design practices, especially those based on established IPC standards, play a central role in enabling sustainable PCB production. By ensuring designs are manufacturable and reliable, engineers can significantly reduce the environmental impact of their products. Let’s explore how adhering to design rules can directly contribute to sustainability and why poor designs can derail these efforts.
The Hidden Cost of Bad Design
Poorly designed PCBs often result in low manufacturing yields, leading to higher scrap rates. For every lot that fails, manufacturers must remake boards, consuming additional materials, energy, and manpower. This cycle not only increases production costs but also amplifies the environmental footprint of each PCB produced.
For example, a design with inadequate annular rings or insufficient conductor or plane clearances may cause defects such as open circuits or shorts. Badly conceived or overly complex HDI stackups can lead to registration issues, delamination, and other non-compliances. These issues often require rework or remakes, both resource-intensive processes. The wasted copper, laminate, chemicals, and labor could have been avoided with a well-structured, IPC-compliant design.
Identifying Design Issues: Tools and Missed Opportunities
The industry has developed advanced tools to identify design issues early in the process, offering the potential to correct problems before manufacturing begins. PCB design tools like Siemens NPI (New Product Introduction) and fabrication tools like Genesis InSight or Integr8tor allow engineers to perform detailed design rule checks (DRCs) and manufacturability analyses. These tools highlight potential risks in the design, such as misaligned drill files, inadequate copper-to-edge clearances, and poorly optimized stackups.
To continue reading this article, which originally appeared in the August 2025 edition of Design007 Magazine, click here.
Testimonial
"Our marketing partnership with I-Connect007 is already delivering. Just a day after our press release went live, we received a direct inquiry about our updated products!"
Rachael Temple - AlltematedSuggested Items
Siemens, ASE Collaborate on Workflows for ASE’s VIPack Advanced Packaging Platform
09/25/2025 | SiemensSiemens Digital Industries Software announced that it is collaborating with Advanced Semiconductor Engineering, Inc. (ASE), the leading global provider of semiconductor manufacturing services in assembly and test, to develop 3Dblox-based workflows for the ASE VIPack™ platform using Siemens’ Innovator3D IC™ solution, which is fully certified for the 3Dblox standard..
Cadence, TSMC Team on AI-Driven Flows and IP for Advanced Nodes, 3DFabric
09/25/2025 | BUSINESS WIRECadence announced major advancements in chip design automation and IP, driven by its long-standing relationship with TSMC to develop advanced design infrastructure and accelerate time to market, for AI and HPC customer applications.
Siemens Collaborates with TSMC to Accelerate 3D IC and AI-driven Circuit and Systems Design
09/24/2025 | SiemensAt the 2025 TSMC North America Open Innovation Platform® (OIP) Ecosystem Forum, Siemens Digital Industries Software announced multiple new collaborations with TSMC, including product certifications and innovative design solutions enablement initiatives for the foundry’s newest and most advanced process technologies.
American Standard Circuits to Exhibit at the Battery Show 2025
09/24/2025 | American Standard CircuitsAmerican Standard Circuits/ASC Sunstone Circuits will be exhibiting at the Battery Show North America to be held at Huntington Place in Detroit, Michigan, October 6-9, 2025.
Blueshift Launches PhaseBlue 1500 Series Circuit Material
09/22/2025 | BlueshiftBlueshift, a U.S.-based technology leader in advanced materials, is introducing PhaseBlue® 1500, the first product in its Series Circuit Materials (SCM) line at this year’s (2025) European Microwave Show.