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Spirit Electronics Orders Hentec Industries/RPS Automation Photon Steam Aging System
August 25, 2025 | Hentec Industries/RPS AutomationEstimated reading time: 1 minute
The Photon steam aging system is used for accelerated life testing - achieved by subjecting the components to a heated, moisture-rich environment, to simulate elongated storage conditions. It has been designed to meet military and other high reliability requirements and specifications.
Including several configuration options and the ability to run multiple product types at once, the Photon can be customized to fit the needs of our customers. The Photon Steam Aging system fully complies with all relevant industry standards, including the MIL-STD-202 Method 208 and ANSI-J.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
Molex Completes Acquisition of Teramount Ltd.
05/07/2026 | PRNewswireMolex, a global electronics leader and connectivity innovator, has completed the acquisition of Teramount Ltd., an Israel‑based developer of detachable fiber‑to‑chip connectivity solutions optimized for high‑volume Co‑Packaged Optics (CPO) and other silicon photonics applications.
Xanadu, EV Group Partner to Build Industrial-Scale Photonic Quantum Hardware
05/05/2026 | PRNewswireXanadu Quantum Technologies Ltd., a leading photonic quantum computing company, and EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, announced a strategic partnership to develop critical heterogeneous integration and wafer bonding processes to facilitate the scalability of photonic quantum systems.
GlobalFoundries Advances Co-Packaged Optics for AI Data Centers with SCALE Module
05/04/2026 | GlobalFoundriesGlobalFoundries (Nasdaq: GFS) (GF) announced the introduction of its SCALE™ optical module solution for co-packaged optics (CPO).
Future-proof Laser Depaneling for PCBs with Photonics
04/10/2026 | Real Time with... APEX EXPOBill Solari of Photonics Systems USA outlines the advantages of laser depaneling for circuit board manufacturing. We learn that this advanced technology addresses rising material costs by increasing panel yield and improving edge quality. This process provides precision, suitability for medical applications, and cost-saving benefits, including the elimination of cleaning steps. There have been significant advancements in laser depaneling, offering a competitive and efficient solution for modern electronics production.
PIC & Mix: How Quantum Technologies are Shaking up the Photonic Integrated Circuit Market
04/08/2026 | IDTechExPhotonic integrated circuits (PICs) are optical systems fabricated on semiconductor wafers, allowing complex optical processes to be performed on a chip-scale device.