Elementary Mr. Watson: Chasing Checkmarks, Not Signal Integrity
Target Condition: Rethinking the PCB Stackup Recipe
Connect the Dots: Evolution of PCB Manufacturing—Lamination
The Power Integrity Issue: Design007 Magazine October 2025
October 8, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Power integrity wasn’t a big problem for most PCB designers until the 2000s, when power-hungry chips and features likewise forced the industry to take notice. But as technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Our featured contributors include Heidi Barnes of Keysight Technologies, Istvan Novak of Samtec, Zach Caprai of Siemens EDA, and columnists John Watson, Barry Olney, Kelly Dack, and Vern Solberg. We have a column by Matt Stevenson, and another article in a series by Anaya Vardya. Beth Massey of MacDermid Alpha Electronics Solutions discusses various potting compounds that can help manage issues such as CTE mismatch in RF applications.
Share on:
Testimonial
"We’re proud to call I-Connect007 a trusted partner. Their innovative approach and industry insight made our podcast collaboration a success by connecting us with the right audience and delivering real results."
Julia McCaffrey - NCAB GroupSuggested Items
Honeywell, LS Electric Announce Global Partnership
10/08/2025 | PRNewswireHoneywell announced a global strategic collaboration with LS ELECTRIC to jointly develop and market hardware and software solutions that simplify the power management and distribution for data centers and other building operators, helping improve operational efficiency and resiliency.
EDADOC Ushers in a New Era of Robotics Innovation
10/07/2025 | Edy Yu, Editor-in-Chief, ECIOOn Sept. 11, Shanghai Zhiyuan Technology Co., Ltd. (MScape) made a stunning debut at Shanghai’s 2025 Fourth North Bund Cybersecurity Forum and Cyber Intelligence Security Frontier Technology and Equipment Exhibition. The company presented the world’s first Dvorak super heterogeneous architecture and the Zhijing T-series-embodied intelligence (robotics) edge computing power platform. This has been a game-changer in the cybersecurity technology field, filling the gap in the domestic robotics core computing power platform.
Indium to Showcase Sustainable Solder Paste and Alloy Technologies at Detroit Battery Show
10/03/2025 | Indium CorporationIndium Corporation, a leading materials refiner, smelter, manufacturer, and supplier to the global electronics, semiconductor, automotive, electric vehicle (EV), thin-film, and thermal management markets, will feature a range of sustainable, high-reliability solder products at The Battery Show North America, to be held October 7-9 in Detroit, Michigan.
Indium Features Next-Generation Materials for Semiconductor Assembly at IMAPS
09/29/2025 | Indium CorporationIndium Corporation, an industry leader in innovative materials solutions for semiconductor packaging and assembly, will feature its lineup of high-reliability products at the International Symposium on Microelectronics, organized by the International Microelectronics Assembly and Packaging Society (IMAPS), to be held from September 29 to October 2 in San Diego, California.
Orbit International’s Power Group Receives Two Contract Awards Totaling Approximately $1,500,000
09/29/2025 | Globe NewswireOrbit International Corp., an electronics manufacturer and software solution provider, announced that its Power Group (OPG) received two contract awards totaling approximately $1,500,000.