Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
Beyond Design: The Fundamental Structure of Spectral Integrity
The Shaughnessy Report: Watt About Power Integrity?
The Power Integrity Issue: Design007 Magazine October 2025
October 8, 2025 | I-Connect007 Editorial TeamEstimated reading time: Less than a minute
Power integrity wasn’t a big problem for most PCB designers until the 2000s, when power-hungry chips and features likewise forced the industry to take notice. But as technologies such as chiplets and 3D-IC continue to proliferate, solid knowledge of PI design techniques will become a critical tool in your toolbox. This month, our experts share “watt’s up” with power integrity, from planning and layout through measurement and manufacturing.
Our featured contributors include Heidi Barnes of Keysight Technologies, Istvan Novak of Samtec, Zach Caprai of Siemens EDA, and columnists John Watson, Barry Olney, Kelly Dack, and Vern Solberg. We have a column by Matt Stevenson, and another article in a series by Anaya Vardya. Beth Massey of MacDermid Alpha Electronics Solutions discusses various potting compounds that can help manage issues such as CTE mismatch in RF applications.
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Elementary, Mr. Watson: Heat—The Hidden Villain of Power Electronics
10/28/2025 | John Watson -- Column: Elementary, Mr. WatsonIf electricity were a group of college students, then power electronics and the PCB designers who dive into it would insist on driving the car on every road trip because they know the car inside and out—they’re the students with jumper cables in the trunk, a tire pressure gauge in the glove box, and snacks stashed under the seat. While the others argue over playlists and directions, power electronics is busy ensuring the alternator doesn’t fry, the headlights don’t dim, and everyone reaches the destination with fuel still in the tank.
Infineon to Purchase Long-Term Green Electricity from Wind Farms in Brandenburg, Germany and Solar Plants in Spain
10/27/2025 | InfineonInfineon Technologies AG has concluded Power Purchase Agreements (PPA) with PNE AG and Statkraft for green electricity.
I-Connect007 Editor’s Choice: Five Must-Reads for the Week
10/24/2025 | Andy Shaughnessy, I-Connect007This week, we have quite a bit of international content in this week’s list of must-reads. Nothing happens in a vacuum, including electronics manufacturing and design, and this has been quite an eventful year. How many of us are now tariff experts? I’m certainly not, but that hasn’t stopped me from opining about the situation.
AI Triggers Next Paradigm Shift in PDN
10/23/2025 | Istvan Novak, SamtecArtificial intelligence (AI), together with machine learning (ML), is creating an unprecedented surge of computing and networking infrastructure needs. This, in turn, has dramatically increased the power consumption of computing and networking chips.
PDN Optimization: Balancing Performance and Cost in SoC Designs
10/22/2025 | Zach Caprai. Siemens EDAThis article demonstrates advanced PDN optimization techniques through a real-world case study of AMD’s Versal adaptive SoC platform. Using the VCK190 evaluation kit featuring the Versal AI Core series VC1902 device, I’ll explore how effective PDN design and optimization can help meet demanding technical specifications while addressing essential business goals.