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Global Electronics Association and FED Open Call for Abstracts for 2027 Pan-European Design Conference
April 30, 2026 | Global Electronics AssociationEstimated reading time: 2 minutes
The German Electronics Design and Manufacturing Association (FED) and the Global Electronics Association are officially opening the Call for Abstracts for the Third Pan-European Electronics Design Conference (PEDC).
The theme is "Advancing Electronics: From Silicon to Systems," and experts from industry, academia, and development are invited to submit practice-oriented contributions. Abstracts for technical presentations can be submitted until June 30. The conference will take place Jan. 27–28, 2027, in Amsterdam, focusing on the critical synergy between advanced design and next-generation technologies.
Conference Focus and Topics
The conference focuses on connecting the European electronics industry and the scientific community and highlights the latest developments in electronics design from “silicon to systems.” We are seeking submissions that provide in-depth insight into current industrial challenges and present viable, real-world solutions. This year’s core topics include:
- Silicon-to-Systems Design: Package-to-PCB co-design (e.g., UHDI, IC-substrates), electro-mechanical optimization, and multi-physics simulations (e.g., SI/PI, thermal, mechanical).
- High-Performance and Power Electronics: HPC and AI Data Centers, EV power delivery, battery management and cooling solutions.
- Next-Gen Applications: Sense-control-communication for space, defense, and autonomous driving; high-speed digital and RF/microwave design.
- Design for Excellence (DFX): Circularity, compliance, carbon footprint, manufacturability, and reliability.
- Design Software and Tools: Novelties in EDA software, AI implementation in design, digital twin, and data handshakes between design and production.
- Sustainability and Lifecycle: Eco-friendly materials, cross-industry data management, and end-of-life/obsolescence management.
- Process Orchestration: Design verification, testing of PCB assemblies, and development workflow management.
A Forum for the Expert Community
"Our primary goal is to provide maximum value for our participants," said Dieter Mueller, FED chair. "We are looking for presentations that offer clear orientation, provide a realistic assessment of technological trends, and deliver content that can be directly applied to daily operations. In Amsterdam, we will bring together international experts to shape the future of electronics at eye level."
Speakers will present their expertise to a high-profile audience of electronic designers, manufacturing specialists, process managers, and decision-makers from management, procurement, and academia. Speakers benefit from high visibility through extensive media coverage before, during, and after the conference.
"PEDC is built by the design community, for the design community,” said Peter Tranitz, senior director Technology Solutions, Global Electronics Association. “We are looking for abstracts that push the boundaries of electronics design, particularly in emerging fields like silicon-to-systems, AI in electronics development, design for excellence and sustainability. Join us in fostering a truly pan-European exchange that supports the growth of Europe’s electronics ecosystem."
Detailed information regarding the submission process and the Call for Abstracts can be found at www.pedc.eu.
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