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PADS Paper, Part 4: QFN Components
June 3, 2015 | Mentor GraphicsEstimated reading time: Less than a minute

This paper, the fourth and final in a series downloaded by thousands of PCB designers, is dedicated to CAD library quality. It describes every aspect you need to consider when creating quad flat no-lead (QFN) component library parts.
It also describes the impact each feature has in the PCB process. To read this paper, click here.
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Julia McCaffrey - NCAB GroupSuggested Items
Hardware Engineers, Manufacturing Leaders Ready to ‘Build Better’ Electronics
10/06/2025 | Marcy LaRont, I-Connect007According to Instrumental’s dynamic CEO, Anna-Katrina Shedletsky, the Build Better Electronics Manufacturing Summit on Sept. 30 was a passion project meant to provide a forum for hardware engineering senior leadership, who have very busy jobs and limited opportunities, to share information, thought leadership, and networking opportunities. “Build Better is really about cross-pollination and sharing,” she said, as she highlighted the importance of supporting this type of sharing in tech, which may be more important than ever before.
Dan’s Biz Bookshelf: Four Important Books You Need to Read (Not Just Say You Have)
09/18/2025 | Dan Beaulieu -- Column: Dan's Biz BookshelfDan Beaulieu continues his popular book review series by reviewing four classic books that he believes everyone should have on their bookshelf. In this column, he reviews "The Prince" by Niccolò Machiavelli, "The Art of War," by Sun Tzu, "How to Win Friends and Influence People," by Dale Carnegie, and "Think and Grow Rich," by Napoleon Hill. While we've all heard of these books and maybe read them, Dan will give you a new perspective.
Intel Announces Key Leadership Appointments to Accelerate Innovation and Strengthen Execution
09/09/2025 | Intel CorporationIntel Corporation today announced a series of senior leadership appointments that support the company’s strategy to strengthen its core product business, build a trusted foundry, and foster a culture of engineering across the business.
Summit Interconnect Announces Appointment of Leo LaCroix as Chief Operating Officer
09/09/2025 | Summit Interconnect, Inc.Summit Interconnect, a leading North American manufacturer of Printed Circuit Boards (PCBs), today announced that Leo LaCroix has assumed the role of Chief Operating Officer (COO).
Leadership Change at Koh Young Europe
08/14/2025 | Koh YoungAfter 16 years of leading Koh Young Europe as General Manager, we would like to announce that Harald Eppinger will step down from his executive role.