-
- News
- Books
Featured Books
- design007 Magazine
Latest Issues
Current IssueAdvanced Packaging and Stackup Design
This month, our expert contributors discuss the impact of advanced packaging on stackup design—from SI and DFM challenges through the variety of material tradeoffs that designers must contend with in HDI and UHDI.
Rules of Thumb
This month, we delve into rules of thumb—which ones work, which ones should be avoided. Rules of thumb are everywhere, but there may be hundreds of rules of thumb for PCB design. How do we separate the wheat from the chaff, so to speak?
Partial HDI
Our expert contributors provide a complete, detailed view of partial HDI this month. Most experienced PCB designers can start using this approach right away, but you need to know these tips, tricks and techniques first.
- Articles
- Columns
Search Console
- Links
- Media kit
||| MENU - design007 Magazine
Top Gear: PADS Professional Road Test
October 12, 2015 | Barry Olney, In-Circuit DesignEstimated reading time: 3 minutes
We hear all the hype about new EDA tools, but how do they actually perform on your design? This month, I road-test Mentor Graphics’ new PADS Professional and put it through a rigorous performance evaluation. Let’s see how the Xpedition technology actually performs when integrated into the PADS tool suite.
Opening the hood, we see an impressive line-up of features including signal and power integrity, thermal analysis and DRC support for traces violating split planes, reference plane changes and shielding. All the essentials for today’s complex high-speed designs! Plus, I am looking forward to trying the dynamic plane generation feature—regenerating copper pours is always a pain to perform, in any software. And of course, PADS Professional includes all the standard features one would expect in a high-end tool.
Based on Xpedition technology, PADS Professional is a major improvement over the previous PADS suite of tools. I was first impressed by this technology in 1994, when I attended the VeriBest PCB training and the sales kick-off in Boulder, Colorado. During the sessions, a few of the Intergraph Electronics sales guys were taken out back, into R&D, and were shown the latest routing technology—eyes lit up with dollar signs as the VeriBest (now Xpedition) router was put through its paces.
Meanwhile back in Australia, where I was responsible for Intergraph Electronics sales and support, customers were also suitably impressed. My first sale was six seats of VeriBest PCB with 20 seats of Design Capture to Fujitsu Australia, who had previously used Cadence. Both Cadence and Mentor presented their flagship products (Allegro and Board Station, respectively), but the VeriBest router was so impressive that the competition did not rate mentioning. Ron Oates, CAD manager of Fujitsu Australia at that time, stated in a press release, “VeriBest is light years ahead of the competitors.” And it is still arguably the best routing technology available today. Mentor went on to acquire VeriBest in 1999, as the lack of routing technology formed a fairly large hole in their PCB offerings. Needless to say, Mentor’s stock rose 9% after the acquisition was announced.
I won’t bore you with a full list of functionality or standard EDA tool features, but rather I will take you through, in detail, what I see as the outstanding features of PADS Professional.
PADS Professional utilizes xDX Designer as the front-end design entry tool. This schematic capture package was originally a ViewLogic Systems tools called ViewDraw, which became the unified front-end tool for all Mentor PCB products some years ago following an acquisition. Originally developed for creating hardware description language (HDL) function blocks for digital and mixed-signal systems, such as FPGAs and ASICs, it has a multitude of interfaces and is adaptable to many environments. In the PADS environment, it interfaces to the PCB (of course) but also allows FPGA I/O optimization, the integration of library tools, DxDatabook, and downstream digital and analog (EZWave) simulation tools.
But as far as I am concerned, the ability to launch HyperLynx LineSim at the schematic level is its best attribute. After selecting a net, the LineSim link loads the data from xDX Designer and exports it to HyperLynx to create a pre-layout free-form schematic view of the nets topology as in Figure 2. You can then simulate a sample of nets for, say, data, address, clocks and strobes to define the layout design rules. These rules are embedded in the schematic via the constraints manager, and they will then flow through to the layout database with forward annotation. Constraints are maintained through a common database that is consistent and in an easy-to-use spreadsheet interface. There is no need to learn an obscure program language to create complex constraints as in other tools.
To read this entire article, which appeared in the September 2015 issue of The PCB Design Magazine, click here.
Suggested Items
BOOK EXCERPT: The Printed Circuit Designer’s Guide to... High Performance Materials, Chapter 4
01/02/2025 | I-Connect007In Chapter 4, Michael Gay discusses the two main types of copper foil used for PCB boards today: electrodeposited (ED) foil and rolled annealed (RA) foil. He also explains the pros and cons of each, and provides an update of the latest innovations in copper foil technology.
Connect the Dots: Designing for Reality—Solder Mask and Legend
01/02/2025 | Matt Stevenson -- Column: Connect the DotsIn the previous episode of I-Connect007’s On the Line with… podcast, we discussed the strip, etch, and strip process. At this point, we have a functioning board, but we still need to protect the PCB from environmental effects and document the circuit components. This brings us to the solder mask and legend phase of production.
Global PCB Connections: Following DFM Rules Leads to Better Boards
12/18/2024 | Jerome Larez -- Column: Global PCB ConnectionsAs a PCB field applications engineer, ensuring smooth communication between PCB designers and fabricators is one of my frequent challenges. A critical part of that dialogue is design for manufacturing (DFM). Many designers, even experienced ones, often misunderstand or overlook important DFM considerations. They may confuse design rules with manufacturing minimums, leading to technically feasible designs that are difficult or costly to produce. In this column, I will clarify some common DFM guidelines and help designers understand the difference between “design rules” and “minimums” while sharing best practices that will simplify the production process and ensure the highest quality PCB.
Sayonara to the Last Standing Copper Foil Plant in North America
12/17/2024 | Marcy LaRont, I-Connect007In July 2021, PCB007 Magazine published an interview with Michael Coll and Chris Stevens of Nippon Denkai about the new acquisition by Nippon Denkai of the last-standing ED foil manufacturer in North America. The plant in Augusta, Georgia, was formerly owned by Oak Mitsui, Inc. and had been purchased by Nippon Denkai the previous March, after which significant investment was made with the expectation of providing more jobs.
SCHMID Group Unveils Enhanced InfinityLine H+ for Electroless Copper Deposition
12/16/2024 | SCHMID GroupThe SCHMID Group, a global leader in high-tech solutions for the electronics industry, proudly announces significant updates to its flagship InfinityLine H+ Electroless Cu system. Specifically designed for the production of high- performance advanced packaging applications using mSAP and SAP processes, the system reflects SCHMID’s expertise in horizontal electroless copper deposition.