-
- News
- Books
Featured Books
- I-Connect007 Magazine
Latest Issues
Current Issue
Beyond the Rulebook
What happens when the rule book is no longer useful, or worse, was never written in the first place? In today’s fast-moving electronics landscape, we’re increasingly asked to design and build what has no precedent, no proven path, and no tidy checklist to follow. This is where “Design for Invention” begins.
March Madness
From the growing role of AI in design tools to the challenge of managing cumulative tolerances, these articles in this issue examine the technical details, design choices, and manufacturing considerations that determine whether a board works as intended.
Looking Forward to APEX EXPO 2026
I-Connect007 Magazine previews APEX EXPO 2026, covering everything from the show floor to the technical conference. For PCB designers, we move past the dreaded auto-router and spotlight AI design tools that actually matter.
- Articles
- Columns
- Links
- Media kit
||| MENU - I-Connect007 Magazine
Orbotech's PCB Business Posts Revenue of $64.2M in Q3 2015
November 9, 2015 | OrbotechEstimated reading time: 4 minutes
2015 third quarter highlights compared with 2014 third quarter
- Revenues of $190.5 million, up 13.9% compared with $167.3 million
- Non-GAAP EPS of $0.55 (diluted), compared with $0.36 adjusted to acquiring SPTS on July 1st, 2014
- GAAP EPS of $0.37 (diluted), compared with $0.17 (diluted)
2015 fourth quarter guidance
- Revenue range: $184 million to $192 million
- Gross margin: approximately 45%.
ORBOTECH LTD. has announced its consolidated financial results for the third quarter and nine months ended September 30, 2015.
Commenting on the results, Asher Levy, Chief Executive Officer, said, “We are very pleased to report robust top-line growth and profitability. We continue to execute consistently on our business plan and make strong progress towards achieving our operating model goals. We remain committed to innovation, as evidenced by today’s announcement of the launch of two products designed for Printed Circuit Board Solder Mask production. The Company’s results for the third quarter and year-to-date clearly demonstrate the strength of our business model - which enjoys healthy diversification across businesses, industries, product lines and geographies. As we look forward into 2016, we are confident in our ability to continue to capitalize on the growth opportunities available to the Company.”
Revenues for the third quarter of 2015 totaled $190.5 million, up 13.9% from $167.3 million in the third quarter of 2014.
In the Company’s Production Solutions for Electronics Industry segment:
- Revenues from the Company’s semiconductor device (“SD”) business were $70.2 million, including $58.4 million in equipment sales, in the third quarter of 2015. This compares to SD business revenues of $53.3 million (including $45.6 million in equipment sales) in the third quarter of 2014. Revenues from the SD business on a standalone basis for the full third quarter of 2014 totaled $57.3 million.
- Revenues from the Company’s printed circuit board (“PCB”) business were $64.2 million, including $34.5 million in equipment sales, in the third quarter of 2015. This compares to PCB revenues of $71.7 million (including $41.4 million in equipment sales) in the third quarter of 2014.
- Revenues from the Company’s flat panel display (“FPD”) business were $48.5 million, including $38.6 million in equipment sales, in the third quarter of 2015. This compares to FPD revenues of $34.9 million (including $26.7 million in equipment sales) in the third quarter of 2014.
Revenues in the Company’s other segments were $7.6 million in the third quarter of 2015, compared with $7.4 million in the third quarter of 2014.
Service revenues for the third quarter of 2015 were $53.5 million, compared with $47.8 million in the third quarter of 2014.
Revenues for the first nine months of 2015 totaled $564.3 million, compared with $385.3 million in the first nine months of 2014 (excluding the Company’s SD business, revenues totaled $372.1 million, up 12.1% from $332.0 million the first nine months of 2014).
Gross profit and gross margin in the third quarter of 2015 were $86.3 million and 45.3%, respectively, compared with $74.0 million and 44.2%, respectively, in the third quarter of 2014. Gross profit and gross margin in the first nine months of 2015 were $255.2 million and 45.2%, respectively, compared with $168.3 million and 43.7%, respectively, in the first nine months of 2014.
GAAP net income for the third quarter of 2015 was $15.9 million, or $0.37 per share (diluted), up from $7.4 million, or $0.17 per share (diluted), for the third quarter of 2014. GAAP net income for the first nine months of 2015 was $40.7 million, or $0.94 per share (diluted), up from $22.3 million, or $0.52 per share (diluted), for the first nine months of 2014. GAAP net income for the first nine months of 2015 included a pre-tax gain of approximately $0.6 million related to the sale of the Company’s Thermal Products business.
Adjusted EBITDA (as defined below) and adjusted EBITDA margin for the third quarter of 2015 were $37.1 million and 19.5%, respectively, up from $32.0 million and 19.1%, respectively, in the third quarter of 2014. Adjusted EBITDA and adjusted EBITDA margin for the first nine months of 2015 were $107.6 million and 19.1%, respectively, up from $58.4 million and 15.2%, respectively, in the first nine months of 2014.
Non-GAAP net income and non-GAAP net income margin for the third quarter of 2015 were $23.7 million and 12.4%, respectively, compared with $22.6 million and 13.5%, for the third quarter of 2014. Non-GAAP net income in the third quarter of 2014 was positively affected in the amount of $7.3 million as a result of the timing of incurrence of expenses and the recognition of revenues as a result of the SPTS acquisition timing, as previously disclosed. Non-GAAP net income and non-GAAP net income margin for the first nine months of 2015 were $67.4 million and 11.9%, respectively, compared with $41.3 million and 10.7%, for the first nine months of 2014.
Non-GAAP earnings per share (diluted) for the third quarter of 2015 was $0.55, compared with $0.53 per share (diluted), for the third quarter of 2014. Non-GAAP earnings per share in the third quarter of 2014 were positively affected in the amount of $0.17, likewise due to the SPTS acquisition timing factors discussed above. Non-GAAP earnings per share (diluted) for the first nine months of 2015 was $1.56, compared with $0.97 per share (diluted), for the first nine months of 2014.
A reconciliation of each of the Company’s non-GAAP measures to the comparable GAAP measure is included at the end of this press release (the “Reconciliation”).
As of September 30, 2015, the Company had cash, cash equivalents (including restricted cash) short-term bank deposits and marketable securities of approximately $193.2 million, and debt of $270.3 million. In the third quarter of 2015, the Company generated cash of $7.8 million from operations and repaid $8.2 million of its term loan.
Fourth Quarter and 2015 Guidance
The Company expects revenues for the fourth quarter and full year of 2015 to be in the range of $184 million to $192 million and $748 million to $756 million, respectively, and gross margin for both the fourth quarter and full year of 2015 of approximately 45%.
About Orbotech Ltd.
Orbotech Ltd. (NASDAQ:ORBK) is a global innovator of enabling technologies used in the manufacture of the world’s most sophisticated consumer and industrial products throughout the electronics and adjacent industries. The Company is a leading provider of yield enhancement and production solutions for electronics reading, writing and connecting, used by manufacturers of printed circuit boards, flat panel displays, advanced packaging, micro-electro-mechanical systems and other electronic components. Virtually every electronic device in the world is produced using Orbotech systems. For more information, visit http://www.orbotech.com/.
Testimonial
"Advertising in PCB007 Magazine has been a great way to showcase our bare board testers to the right audience. The I-Connect007 team makes the process smooth and professional. We’re proud to be featured in such a trusted publication."
Klaus Koziol - atgSuggested Items
BGA Technology Expands Inspection Capabilities with Creative Electron TruView X-ray System
05/08/2026 | BGA TechnologyBGA Technology, a leading provider of advanced electronics testing and inspection services, has enhanced its inspection capabilities with the addition of a Creative Electron TruView™ Simplex X-ray system at its Holbrook, New York facility.
AQUANOX A4727 and A4625 Lead KYZEN Offerings at SMTA Oregon Expo and Tech Forum
05/06/2026 | KYZENKYZEN, the global leader in innovative environmentally responsible cleaning chemistries, will exhibit at the SMTA Oregon Expo and Tech Forum scheduled to take place Thursday, May 19 at the Wingspan Event and Conference Center in Hillsboro, Oregon.
Connect the Dots: Designing for the Future of Manufacturing Reality—Surface Finish
05/07/2026 | Matt Stevenson -- Column: Connect the DotsWhen designing the complex boards that many electronic devices require to operate, designers should consider manufacturability at every step. This is my last article focused on designing for the always-evolving manufacturing reality. Choosing the right surface finish has always been important. If you are creating intricate designs with a wide variety of components, like for an ultra-high density interconnect (UHDI) board, surface finish is a critical last step.
Indium to Showcase High-Performance AI Application Solutions at SEMICON SEA 2026
05/01/2026 | Indium CorporationAs a leading provider of advanced materials solutions for today’s demanding AI applications, Indium Corporation® will feature its high-reliability product portfolio at SEMICON SEA 2026, May 5-7, in Kuala Lumpur, Malaysia.
ACCM Unveils Negative and Near-zero CTE Materials for Large-Format AI Chips
04/21/2026 | Advanced Chip and Circuit MaterialsAdvanced Chip and Circuit Materials, Inc. (ACCM) has launched two new materials: Celeritas HM50, with a negative coefficient of thermal expansion (CTE) of -8 ppm/°C to offset the positive CTE and expansion of copper with temperature on circuit boards, and Celeritas HM001, with near-zero CTE and the low-loss performance needed for high-speed signal layers to 224 Gb/s and faster in artificial intelligence (AI) circuits.